Semiconductor device and method of fabricating the same

ABSTRACT

A polysilicon film, a titanium silicide film and a titanium nitride film are formed in a storage node contact hole of a memory cell region, while a polysilicon film, a titanium silicide film and a titanium nitride film are formed in a bit line contact hole. In a peripheral circuit region, a peripheral circuit contact hole is formed in a silicon oxide film, and another peripheral circuit contact hole is formed in an interlayer insulation film and a silicon oxide film. Thus obtained are a semiconductor device reducing a leakage current, suppressing an electrical short and attaining a high-speed operation while readily forming each contact hole and a method of fabricating the same.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a semiconductor device and a method of fabricating the same, and more particularly, it relates to a semiconductor device which reduces a leakage current and improves its operating speed while electrically connecting an element of a memory cell region with that of a peripheral circuit region in an excellent state and a method of fabricating the same.

[0003] 2. Description of the Prior Art

[0004] First, a method of fabricating a first exemplary conventional dynamic random access memory (hereinafter referred to as a DRAM), i.e., an exemplary conventional semiconductor device, is now described with reference to FIGS. 54 to 78.

[0005] Referring to FIG. 54, element isolation oxide films 2 a and 2 b are formed on prescribed regions of a silicon substrate 1 by trench isolation, for forming a memory cell region 1 a and a peripheral circuit region 1 b.

[0006] Referring to FIG. 55, boron is injected into the memory cell region 1 a and a first area of the peripheral circuit region 1 b, for forming p-type wells 3 a and 3 b respectively.

[0007] Referring to FIG. 56, phosphorus is injected into a second area of the peripheral circuit region 1 b, for forming an n-type well 4.

[0008] Referring to FIG. 57, a gate oxide film 5 is formed on the silicon substrate 1 by thermal oxidation or the like. A polysilicon film and a tungsten silicide film 6 are formed on the gate oxide film 5. A silicon oxide film 7 is formed on the tungsten silicide film 6. Thereafter gate electrode portions 8 a, 8 b and 8 c are formed by photolithography and etching.

[0009] Referring to FIG. 58, the n-type well 4 is covered with a photoresist pattern 48 a and thereafter phosphorus is injected by ion implantation, for forming n source/drain regions 9 a, 9 b, 9 c and 9 d. Thereafter the photoresist pattern 48 a is removed.

[0010] Referring to FIG. 59, the p-type wells 3 a and 3 b are covered with a photoresist pattern 48 b and thereafter boron is injected by ion implantation, for forming p source/drain regions 10 a and 10 b. Thereafter the photoresist pattern 48 b is removed.

[0011] Referring to FIG. 60, a silicon oxide film 11 is formed on the silicon substrate 1, to cover the gate electrode portions 8 a, 8 b and 8 c.

[0012] Referring to FIG. 61, the silicon oxide film 11 is anisotropically etched for forming sidewall oxide films 12 on both side surfaces of the gate electrode portions 8 a, 8 b and 8 c respectively.

[0013] Referring to FIG. 62, a photoresist film 48 c is formed to cover the n-type well 4. Thereafter the photoresist film 48 c is employed as a mask for injecting phosphorus by ion implantation, thereby forming n⁺ source/drain regions 13 a, 13 b, 13 c and 13 d. Thus formed is a MOS transistor T1 of an LDD structure including n-type source/drain regions 15 a and 15 b and the gate electrode portion 8 a. Further formed is a MOS transistor T2 of an LDD structure including n-type source/drain regions 15 c and 15 d and the gate electrode portion 8 b. Thereafter the photoresist film 48 c is removed.

[0014] Referring to FIG. 63, a photoresist film 48 d is formed to cover the p-type wells 3 a and 3 b. Thereafter the photoresist film 48 d is employed as a mask for injecting boron by ion implantation, thereby forming p⁺ source/drain regions 14 a and 14 b. Thus formed is a MOS transistor T3 including p-type source/drain regions 16 a and 16 b and the gate electrode portion 8 c. Thereafter the photoresist film 48 d is removed.

[0015] Referring to FIG. 64, a silicon oxide film 17 is formed on the silicon substrate 1 to cover the gate electrode portions 8 a, 8 b and 8 c.

[0016] Referring to FIG. 65, a bit line contact hole 18 exposing a surface of the n-type source/drain region 15 b is formed in the silicon oxide film 17.

[0017] Referring to FIG. 66, a polysilicon film 40 is buried in the bit line contact hole 18.

[0018] Referring to FIG. 67, a bit line 25 electrically connected to the polysilicon film 40 is formed on the silicon oxide film 17.

[0019] Referring to FIG. 68, a silicon oxide film 26 is formed on the silicon oxide film 17, to cover the bit line 25.

[0020] Referring to FIG. 69, a storage node contact hole 41 a exposing a surface of the n-type source/drain region 15 a is formed in the silicon oxide films 17 and 26.

[0021] Referring to FIG. 70, a polysilicon film 42 is buried in the storage node contact hole 41 a.

[0022] Referring to FIG. 71, a metal film of ruthenium or platinum is formed on the silicon oxide film 26, and a storage node 28 a is formed by prescribed photolithography and etching.

[0023] Referring to FIG. 72, a thin film of a high dielectric constant and a metal film of ruthenium or platinum are successively formed on the storage node 28 a. Thereafter a capacitor dielectric film 28 b and a cell plate 28 c are formed by prescribed photolithography and etching. The storage node 28 a, the capacitor dielectric film 28 b and the cell plate 28 c form a capacitor 28.

[0024] Referring to FIG. 73, an interlayer insulation film 29 is formed on the silicon oxide film 26, to cover the capacitor 28.

[0025] Referring to FIG. 74, peripheral circuit contact holes 43 a and 43 b exposing surfaces of the n-type source/drain regions 15 d and 15 c are formed in the interlayer insulation film 29 and the silicon oxide films 17 and 26. Further, peripheral contact holes 43 c and 43 d are formed to expose surfaces of the p-type source/drain regions 16 a and 16 b. At the same time, a cell plate contact hole 30 is formed to expose a surface of the cell plate 28 c of the capacitor 28.

[0026] Referring to FIG. 75, a titanium film 45 and a titanium nitride film 47 a are formed in the cell plate contact hole 30 by sputtering or the like. Further, titanium films 22 c, 22 d, 22 e and 22 f and titanium nitride films 47 b, 47 c, 47 d and 47 e are formed in the peripheral circuit contact holes 43 a, 43 b, 43 c and 43 d respectively. FIG. 76 shows a portion around the n-type source/drain region 15 d and the p-type source/drain region 16 b in this step in an enlarged manner.

[0027] Thereafter heat treatment is performed to react the titanium films 22 c, 22 d, 22 e and 22 f with silicon contained in the n-type source/drain regions 15 a, 15 b, 15 c and 15 d and the p-type source/drain regions 16 a and 16 b, for forming titanium silicide films 24 c, 24 d, 24 e and 24 f. FIG. 77 shows the portion around the n-type source/drain region 15 d and the p-type source/drain region 16 b in this step.

[0028] Referring to FIG. 78, an aluminum copper film is formed on the interlayer insulation film 29, and metal wires 33 are formed by prescribed photolithography and etching. Thereafter an interlayer insulation film (not shown) and a passivation film (not shown) are formed to cover the metal wires 33, thereby completing the DRAM.

[0029] A method of fabricating a second exemplary conventional DRAM is now described with reference to FIGS. 79 to 86. After a step similar to that shown in FIG. 63 described with reference to the first prior art, a silicon nitride film 56 is formed on a semiconductor substrate 1 to cover gate electrode portions 8 a, 8 b and 8 c, as shown in FIG. 79.

[0030] Referring to FIG. 80, a part of the silicon nitride film 56 formed on a peripheral circuit region 1 b is removed. A silicon oxide film 17 is formed to cover the silicon nitride film 56 and the gate electrode portions 8 b and 8 c. A photoresist film 48 g is formed on the silicon oxide film 17. This photoresist film 48 g is employed as a mask for anisotropically etching the silicon oxide film 17, thereby forming an opening 62 exposing a surface of the silicon nitride film 56.

[0031] Referring to FIG. 81, the photoresist film 48 g is employed as a mask to anisotropically etch the silicon nitride film 56, for forming a bit line contact hole 18 c exposing a surface of an n-type source/drain region 15 b. Thereafter the photoresist film 48 g is removed. Referring to FIG. 82, a polysilicon film 40 is formed to fill up the bit line contact hole 18 c. A bit line 25 electrically connected to the polysilicon film 40 is formed on the silicon oxide film 17.

[0032] Referring to FIG. 83, a silicon nitride film (not shown) is formed on the silicon oxide film 17. Prescribed etching is performed on the silicon nitride film, to leave a silicon nitride film 57 a only on surfaces of the bit line 25. Referring to FIG. 84, a silicon oxide film 26 is formed on the silicon oxide film 17, to cover the silicon nitride film 57 a. A photoresist film 48 h is formed on the silicon oxide film 26. The photoresist film 48 h is employed as a mask to anisotropically etch the silicon oxide films 26 and 16, for forming an opening 63 exposing a surface of the silicon nitride film 56.

[0033] Referring to FIG. 85, the silicon nitride film 56 is further anisotropically etched through the photoresist film 48 h serving as a mask, thereby forming a storage node contact hole 41 a exposing a surface of an n-type source/drain region 15 a. Thereafter steps similar to those of the first prior art shown in FIGS. 70 to 78 are carried out, thereby obtaining the DRAM having a structure shown in FIG. 86.

[0034] In the memory cell region 1 a of the DRAM according to the first or second prior art formed in the aforementioned manner, the storage node 28 a of the capacitor 28 is electrically connected with the n-type source/drain region 15 a of the MOS transistor T1 through the polysilicon film 42 buried in the storage node contact hole 41 a. Further, the bit line 25 is electrically connected with the n-type source/drain region 15 b of the MOS transistor T1 through the polysilicon film 40 buried in the bit line contact hole 18.

[0035] In the peripheral circuit region 1 b, on the other hand, the wiring layers 33 are electrically connected with the n-type source/drain regions 15 c and 15 d of the MOS transistor T2 through the titanium silicide films 24 c and 24 d and the titanium nitride films 47 b and 47 c buried in the peripheral circuit contact holes 43 a and 43 b respectively. Further, the wiring layers 33 are electrically connected with the p-type source/drain regions 16 a and 16 b of the MOS transistor T3 through the titanium silicide films 24 e and 24 f and the titanium nitride films 47 d and 47 e buried in the peripheral circuit contact holes 43 c and 43 d respectively.

[0036] The reason for this is as follows: If a titanium nitride film and a titanium silicide film are formed in the storage node contact hole 41 a of the memory cell region 1 a, silicon contained in the source/drain region 15 a is consumed in formation of the titanium silicide film, to result in an increased leakage current from the source/drain region 15 a to the silicon substrate 1. If polysilicon films are formed in the peripheral circuit contact holes 43 a, 43 b, 43 c and 43 d of the peripheral circuit region 1 b, on the other hand, the electrical resistance is so increased that no high-speed operation can be attained.

[0037] Thus, the polysilicon film 42 is formed in the storage node contact hole 41 a in the memory cell region 1 a, in order to reduce the leakage current. In the peripheral circuit region 1 b, on the other hand, the titanium films 22 c, 22 d, 22 e and 22 f and the titanium nitride films 47 b, 47 c, 47 d and 47 e are formed in the peripheral circuit contact holes 43 a, 43 b, 43 c and 43 d respectively, in order to attain a high-speed operation rather than reduction leakage currents.

[0038] However, the DRAM according to each of the first prior art and the second prior art has the following problems: Due to increased storage capacity of the DRAM, refinement so progresses that it is estimated that the hole diameter of the bit line contact hole 18 or the storage node contact hole 41 a of the memory cell region 1 a is about 0.08 μm in a 1-Gbit DRAM, for example. It is also estimated that the depths of the bit line contact hole 18 and the storage node contact hole 41 a are about 0.5 μm and about 0.8 μm respectively.

[0039] When the polysilicon films 40 and 42 are formed in the bit line contact hole 18 and the storage node contact hole 41 a respectively, the electrical resistance thereof is increased in inverse proportion to the sectional areas of the contact holes 18 and 41 a. It is conceivable that the operating speed of a memory cell in the memory cell region 1 a cannot be increased as a result and it is difficult to attain a higher operating speed of the DRAM.

[0040] If titanium silicide films and titanium nitride films are formed in the storage node contact hole 41 a and the bit line contact hole 18 of the memory cell region 1 a in order to solve this problem, silicon contained in the n-type source/drain regions 15 a and 15 b is consumed in formation of the titanium silicide films, as described above. It is supposed that leakage currents flowing from the n-type source/drain regions 15 a and 15 b to the silicon substrate 1 are consequently increased.

[0041] On the other hand, it is estimated that the hole diameter and the depth of the peripheral circuit contact holes 43 a, 43 b, 43 c and 43 d in the peripheral circuit region 1 b are about 0.15 μm and about 1.0 μm respectively. Thus, it is estimated that the aspect ratio of the hole diameter to the depth of the peripheral circuit contact holes 43 a, 43 b, 43 c and 43 d exceeds 6. Consequently, it is conceivably difficult to form the peripheral circuit contact holes 43 a, 43 b, 43 c and 43 d having a high aspect ratio in the interlayer insulation film 29 and the silicon oxide films 17 and 26.

[0042] When the cell plate contact hole 30 and the peripheral circuit contact holes 43 a, 43 b, 43 c and 43 d are simultaneously formed in the memory cell region 1 a and the peripheral circuit region 1 b respectively, further, the cell plate 28 c is damaged by etching after its surface is exposed and before the surfaces of the n-type source/drain regions 15 c and 15 d and the p-type source/drain regions 16 a and 16 b are exposed. Thus, the cell plate contact hole 30 may be formed to pass through the cell plate 28 c. In this case, it is conceivable that the capacitor 28 is electrically connected with the MOS transistors T2 and T3 of the peripheral circuit region 1 b in an inferior state.

[0043] In the DRAM according to the second prior art, further, the following two problems are supposed in addition to the aforementioned problems: FIG. 87 illustrates the plane structure under the silicon nitride film 56 in the steps of forming the bit line contact hole 18 c shown in FIGS. 80 and 81. FIGS. 80 and 81 show a section taken along the line L3-L3 in FIG. 87 in particular. Referring to FIG. 87, the opening 62 is formed to be located on a substantially central position of the n-type source/drain region 15 b, in particular.

[0044] If the photoresist film 48 g is misaligned in photolithography, however, some opening 62 a may be formed over a part of the gate electrode 8 a. In this case, etching must be further continued after a portion of the silicon nitride film 56 located on a shoulder portion of the gate electrode 8 a is exposed to remove the silicon oxide film 17 a in order to form the opening 62 a, as shown in FIG. 88. FIG. 88 is a sectional view taken along the line L4-L4 in FIG. 87.

[0045] Particularly in a 1-Gbit DRAM, it is necessary to form a fine bit line contact hole having a large aspect ratio, as hereinabove described. In formation of the opening 62 a in the actual process, therefore, gas ions for etching must indispensably be introduced into a deep portion of the opening 62 a as shown by arrows, by setting an alternating voltage applied to the semiconductor substrate 1 at a relatively high level in an etching device.

[0046] In this case, however, it is supposed that the already exposed portion of the silicon nitride film 56 is eroded by the etching while the silicon oxide film 17 a is removed, to expose the sidewall oxide film 12 as well as the polysilicon film 6 of the gate electrode portion 8 a. If the bit line 25 is connected to the n-type source/drain region 15 b of the MOS transistor T1 through the polysilicon film 40 buried in the bit line contact hole 18 in this case, the electrical connection is so inferiorly performed that the bit line 25 and the gate electrode 8 a may be shorted depending on the degree of the etching. It is supposed that the MOS transistor T1 abnormally operates as a result.

[0047] A further problem is now described. FIG. 89 illustrates the plane structure under the bit line 25 in the step shown in FIG. 84. The section shown in FIG. 84 is taken along the line L5-L5 in FIG. 89. Referring to FIG. 89, the opening 63 is formed to be located on a substantially central position of the n-type source/drain region 15 a in particular.

[0048] If the photoresist film 48 h is misaligned in photolithography, however, some opening 63 a may be formed over a part of the bit line 25. In this case, etching must be further continued after a portion of the silicon nitride film 57 a formed on the surfaces of the bit line 25 is exposed to remove the silicon oxide films 26 and 17, as shown in FIG. 90. Therefore, it is supposed that the already exposed portion of the silicon nitride film 57 a is eroded by excessive etching before the silicon oxide film 17 is removed in formation of the opening 63 a, to expose the surfaces of the bit line 25. It is also supposed that the storage node 28 a is electrically shorted with the bit line 25 through the polysilicon film 42 buried in the storage node contact hole 41 a. It is further supposed that no desired operating characteristics of the DRAM are attained as a result. FIG. 90 shows a section taken along the line L6-L6 in FIG. 89.

SUMMARY OF THE INVENTION

[0049] The present invention has been proposed in order to solve the aforementioned supposable problems, and an object thereof is to provide a semiconductor device which reduces a leakage current, suppresses an electrical short and attains a high-speed operation while readily forming each contact hole and electrically connecting elements of a memory cell region and a peripheral circuit region with each other in an excellent state. Another object of the present invention is to provide a method of fabricating such a semiconductor device.

[0050] The semiconductor device according to the present invention comprises a semiconductor substrate, a first region, a first impurity region, a first conductor layer, a second conductor layer, a third conductor layer, a first insulator layer and a first conductor region. The semiconductor substrate has a major surface. The first region is formed on the major surface of the semiconductor substrate. The first impurity region is formed on a surface of the first region. The first conductor layer is formed on a surface of the first impurity region. The second conductor layer is formed on the first conductor layer. The third conductor layer is formed on the second conductor layer. The first insulator layer is formed on the semiconductor substrate to enclose the first to third conductor layers. The first conductor region is formed on the first insulator layer, and electrically connected with the third conductor layer. The first conductor layer contains silicon. The second conductor layer contains a compound of silicon and a prescribed metal. The third conductor layer contains the prescribed metal or a compound of this metal.

[0051] According to this structure, the first conductor region and the first impurity region are electrically connected with each other through the first to third conductor layers. Particularly when the second conductor layer is formed by heat treatment, the metal consumes the silicon contained in the first conductor layer. Thus, the first impurity region can be prevented from being influenced by the heat treatment. Consequently, a leakage current flowing from the first conductor region to the semiconductor substrate through the first impurity region is reduced. The second and third conductor layers contain the metal or the compound of the metal, whereby the electrical resistance between the first conductor region and the first impurity region can be reduced. Consequently, the operating speed of the semiconductor device is improved.

[0052] According to a first preferred aspect of the inventive semiconductor device, the first insulator layer has a first contact hole exposing a surface of the first conductor layer, and the second and third conductor layers are formed in the first contact hole.

[0053] In this case, etching ends on an upper surface of the first conductor layer in formation of the first contact hole, to be inhibited from damaging the region under the first conductor layer.

[0054] According to a second preferred aspect of the present invention, the semiconductor device further includes a pair of source/drain regions which are provided on the major surface of the first region at a space and a gate electrode which is formed on a region of the semiconductor substrate held between the source/drain regions with a gate insulator film interposed, the first one of the pair of source/drain regions includes the first impurity region, and the first conductor layer is formed in the vicinity of the gate electrode to partially cover the gate electrode while being electrically insulated from the gate electrode.

[0055] In this case, etching ends on the upper surface of the first conductor layer in formation of the first contact hole, to be inhibited from influencing the gate electrode. Consequently, the electrical insulation between the first conductor region and the gate electrode is improved, and the semiconductor device attains excellent electrical connection between the first conductor region and the source/drain regions.

[0056] According to a third preferred aspect of the present invention, the semiconductor device further includes a second impurity region which is formed on a major surface of the first region at a space from the first impurity region, a fourth conductor layer containing silicon which is formed on a surface of the second impurity region, a first protective layer which is formed to cover a surface of the first conductor region, and a second insulator layer which is formed on the first insulator layer to cover the first protective layer. The first and second insulator layers have a second contact hole exposing a surface of the fourth conductor layer. The semiconductor device further includes a fifth conductor layer, containing a compound of silicon and the prescribed metal, which is formed in the second contact hole and electrically connected with the fourth conductor layer, a sixth conductor layer, containing the prescribed metal or a compound of this metal, which is formed on the fifth conductor layer in the second contact hole, and a second conductor region which is formed on the second insulator layer and electrically connected with the sixth conductor layer.

[0057] In this case, the depth of the second contact hole is reduced by a value corresponding to the thickness of the fourth conductor layer to reduce the aspect ratio of the second contact hole as compared with the case of forming a contact hole directly exposing the surface of the second impurity region in formation of the second contact hole in the first and second insulator layers for electrically connecting the second conductor region and the second impurity region with each other. Even if the first conductor region is exposed due to misalignment or the like in formation of the second contact hole, therefore, the surface of the first conductor region can be inhibited from exposure resulting from excessive etching of the first protective layer. Consequently, the first and second conductor regions can be prevented from an electrical short by the fifth and sixth conductor layers formed in the second contact hole.

[0058] According to a fourth preferred aspect of the inventive semiconductor device, the second one of the pair of source/drain regions includes the second impurity region, and the gate electrode is formed on a region held between the first and second impurity regions.

[0059] In this case, a MOS transistor is so formed that the first and second conductor regions are connected to the first and second ones of the pair of source/drain regions respectively. This MOS transistor is electrically connected with the first and second conductor regions in an excellent state. Consequently, a semiconductor device including a MOS transistor which is prevented from an electrical short is obtained.

[0060] According to a fifth preferred aspect of the inventive semiconductor device, the first protective layer is a silicon nitride film, and the second insulator layer is a silicon oxide film.

[0061] In this case, the silicon oxide film can be readily selectively etched while substantially leaving the silicon nitride film in formation of the second contact hole. Thus, the surface of the first conductor region can be effectively inhibited from exposure.

[0062] According to a sixth preferred aspect of the present invention, the semiconductor device further includes a second region which is formed on the major surface of the semiconductor substrate and electrically insulated from the first region, a third impurity region which is formed on a surface of the second region, and a third insulator layer which is formed on the second insulator layer to cover the first and second regions. The first and second insulator layers have a third contact hole exposing a surface of the third impurity region. The third insulator layer has a fourth contact hole communicating with the third contact hole. The third insulator layer has a fifth contact hole exposing a surface of the second conductor region. The semiconductor device further includes a first columnar conductor which is formed in the third contact hole and electrically connected with the third impurity region, a second columnar conductor which is formed in the fourth contact hole and electrically connected with the first columnar conductor, a third columnar conductor which is formed in the fifth contact hole, a first wiring layer which is electrically connected with the second columnar conductor and formed on the third insulator layer, and a second wiring layer which is electrically connected with the third columnar conductor and formed on the third insulator layer.

[0063] In this case, the third columnar conductor electrically connects the first wiring layer on the first region with the second conductor region. The first and second columnar conductors electrically connect the second wiring layer on the second region with the third impurity region. The first columnar conductor is formed in the third contact hole. The second columnar conductor is formed in the fourth contact hole. The third columnar conductor is formed in the fifth contact hole. The third contact hole has a depth corresponding to the thickness of the first and second insulator layers, and the fourth contact hole has a depth corresponding to the thickness of the third insulator layer. As compared with the case of forming contact holes having depths corresponding to the thicknesses of the first to third insulator layers, therefore, the depths of the third and fourth contact holes are further reduced to reduce the aspect ratios respectively. Thus, the third and fourth contact holes are further readily formed and inhibited from defective opening, whereby the electrical connection between the second wiring layer and the third impurity region is improved. In simultaneous formation of the fourth and fifth contact holes, the exposed part of the surface of the second conductor region is exposed to etching gas for a time corresponding to that up to exposure of a surface of the first columnar conductor on the bottom of the fourth contact hole. As compared with the case of forming a contact hole directly exposing the surface of the third impurity region, therefore, the time for exposing the exposed part to the etching gas is reduced. Thus, the fifth contact hole can be prevented from partially passing through the second conductor region due to excessive etching of the second conductor region. Consequently, the first wiring layer is electrically connected with the second conductor region in an excellent state.

[0064] According to a seventh preferred aspect of the inventive semiconductor device, the first and second wiring layers are formed by the same layer.

[0065] In this case, the electrical connection between the second conductor region of the first region and the third impurity region of the second region is improved.

[0066] According to an eighth preferred aspect of the present invention, the semiconductor device further includes a relay conductor, larger in sectional area than the first columnar conductor, which is formed on the second insulator layer to intervene between the first and second columnar conductors.

[0067] In this case, the depth of the fourth contact hole is reduced by a value corresponding to the thickness of the relay conductor. Thus, the aspect ratio of the fourth contact hole is further reduced, so that the fourth contact hole can be readily formed. Further, the relay conductor has a larger sectional area than the first columnar conductor, whereby a surface of the relay conductor can be reliably exposed even if misalignment is caused in photolithography in formation of the fourth contact hole. Thus, the electrical connection between the second wiring layer and the third impurity region is further improved.

[0068] According to a ninth preferred aspect of the inventive semiconductor device, the relay conductor is formed by the same layer as the second conductor layer.

[0069] In this case, the relay conductor can be simultaneously formed in formation of the second conductor region, with no requirement for an additional step for forming the relay conductor.

[0070] According to a tenth preferred aspect of the inventive semiconductor device, the first region includes a plurality of element forming regions and an element isolation region for electrically insulating the element forming regions from each other, the gate electrode includes a first gate electrode portion extending on each element forming region and a second gate electrode portion, which is connected with the first gate electrode, extending on the element isolation region, and the semiconductor device further includes a second protective layer which is formed under the first insulator layer to cover the second gate electrode portion.

[0071] In this case, an opening having a relatively large opening area can be formed in the first insulator layer located in each element forming region. In other words, an opening having a reduced aspect ratio can be formed. Thus, a part of the second protective layer, which is formed to cover the gate electrode at first, covering the first gate electrode portion in the element forming region in particular is excessively etched so that only the second protective layer is exposed on the bottom of the opening without exposing the first gate electrode portion. When the exposed part of the second protective layer is thereafter removed, the surfaces of the first and second impurity regions are exposed substantially with no etching of the first gate electrode portion extending on each element forming region. The remaining part of the second protective layer covering the second gate electrode portion extending on the element isolation region is left unremoved. Thus, an opening for forming each element forming region can be readily formed in the first insulator layer without substantially etching the first gate electrode portion.

[0072] According to an eleventh preferred aspect of the inventive semiconductor device, the second protective layer is a silicon nitride film, and the first insulator layer is a silicon oxide film.

[0073] In this case, the silicon oxide film can be readily selectively etched while substantially leaving the silicon nitride film.

[0074] According to a twelfth preferred aspect of the present invention, the semiconductor device further includes a third region which is formed on the major surface of the semiconductor substrate and electrically insulated from the first region, a fourth impurity region which is formed on a surface of the third region, and a fourth insulator layer which is formed on the first insulator layer to cover the first and third regions. The first insulator layer has a sixth contact hole exposing a surface of the fourth impurity region. The fourth insulator layer has a seventh contact hole communicating with the sixth contact hole. The fourth insulator layer also has an eighth contact hole exposing the surface of the first conductor region. The semiconductor device further includes a fourth columnar conductor which is formed in the sixth contact hole and electrically connected with the fourth impurity region, a fifth columnar conductor which is formed in the seventh contact hole and electrically connected with the fourth columnar conductor, a sixth columnar conductor which is formed in the eighth contact hole, and a third wiring layer which is electrically connected with the fifth and sixth columnar conductors and formed on the fourth insulator layer.

[0075] In this case, the sixth columnar conductor electrically connects the third wiring layer on the first region with the first conductor region. The fourth and fifth columnar conductors electrically connect the third wiring layer on the third region with the fourth impurity region. The fourth columnar conductor is formed in the sixth contact hole. The fifth columnar conductor is formed in the seventh contact hole. The sixth columnar conductor is formed in the eighth contact hole. The sixth and seventh contact holes have depths corresponding to the thicknesses of the first and fourth insulator layers respectively. As compared with the case of forming a contact hole having a depth corresponding to the total thickness of the first and fourth insulator layers, therefore, the depths of the sixth and seventh contact holes are further reduced and the aspect ratios thereof are also reduced respectively. Thus, the sixth and seventh contact holes can be further readily formed and inhibited from defective opening, whereby the electrical connection between the third wiring layer and the fourth impurity region is improved. In simultaneous formation of the seventh and eighth contact holes, the exposed part of the surface of the first conductor region is exposed to etching gas for a time corresponding to that up to exposure of the surface of the fourth columnar conductor on the bottom of the seventh contact hole. As compared with the case of forming a contact hole directly exposing the surface of the fourth impurity region, therefore, the time for exposing the exposed part to the etching gas is reduced. Thus, the eighth contact hole can be prevented from partially passing through the first conductor region due to excessive etching of the first conductor region. Consequently, the first conductor region is electrically connected with the fourth impurity region in an excellent state through the third wiring layer.

[0076] According to a thirteenth preferred aspect of the inventive semiconductor device, the semiconductor substrate is a single-crystalline silicon substrate, and the first conductor layer contains silicon or a silicon-germanium alloy.

[0077] In this case, the first conductor layer can be readily formed on a prescribed region of the semiconductor substrate in self alignment.

[0078] According to a fourteenth preferred aspect of the inventive semiconductor device, the prescribed metal includes any metal selected from a group consisting of titanium, cobalt, zirconium and hafnium.

[0079] In this case, the silicon contained in the first conductor layer and the metal readily cause silicide reaction in formation of the second conductor layer. Thus, metal silicide is readily formed.

[0080] The method of fabricating a semiconductor device according to the present invention comprises the following steps: A first impurity region is formed on a major surface of a semiconductor substrate. A first conductor layer containing silicon is formed on a surface of the first impurity region. A conductive material layer containing a prescribed metal is formed on the first conductor layer and heat-treated, thereby forming a second conductor layer containing a compound of the silicon contained in the first conductor layer and the prescribed metal. A third conductor layer containing a metal or a compound of this metal is formed on the second conductor layer. A first insulator layer is formed on the semiconductor substrate to enclose the first to third conductor layers. A first conductor region electrically connected to the third conductor layer is formed on the first insulator layer.

[0081] According to this method, the metal reacts with the silicon contained in the first conductor layer to form metal silicide in formation of the second conductor layer by the heat treatment. Thus, the first impurity region is inhibited from being influenced by the heat treatment. Consequently, a leakage current flowing from the first conductor region to the semiconductor substrate through the first impurity region is suppressed. Further, the second conductor layer containing the metal or the compound of the metal and the third conductor layer reduce the electrical resistance between the first conductor region and the first impurity region. Consequently, a semiconductor device suppressing a leakage current and attaining improvement of its operating speed etc. can be readily fabricated.

[0082] According to a first preferred aspect of the inventive method of fabricating a semiconductor device, the steps of forming the second and third conductor layers include steps of forming a first contact hole exposing a surface of the first conductor layer in the first insulator layer and forming the second and third conductor layers in the first contact hole.

[0083] In this case, etching ends on an upper surface of the first conductor layer in formation of the first contact hole, to be inhibited from damaging the region under the first conductor layer. As compared with the case of forming a contact hole exposing a surface of the first impurity region, the depth of the first contact hole can be reduced by a value corresponding to the thickness of the first conductor layer and the aspect ratio thereof is also reduced. Consequently, the first contact hole can be readily formed.

[0084] According to a second preferred aspect of the present invention, the method of fabricating a semiconductor device further includes steps of forming a gate electrode on the major surface of the semiconductor substrate with a gate insulator film interposed and forming a pair of source/drain regions on the major surface of the semiconductor substrate both sides of the gate electrode, the step of forming the source/drain regions includes the step of forming the first impurity region, and the step of forming the first conductor layer includes a step of forming the same in the vicinity of the gate electrode to partially cover the gate electrode while being electrically insulated from the gate electrode.

[0085] In this case, etching ends on the upper surface of the first conductor layer in formation of the first contact hole, to be inhibited from influencing the gate electrode. Thus, the electrical connection between the first conductor region and the source/drain regions can be improved.

[0086] According to a third preferred aspect of the present invention, the method of fabricating a semiconductor device further includes steps of forming a second impurity region on the major surface of the semiconductor substrate at a space from the first impurity region and forming a fourth conductor layer containing silicon on the second impurity region in advance of the step of forming the first insulator layer. The method further includes steps of forming a first protective layer on the surface of the first conductor region, forming a second insulator layer on the first insulator layer to cover the first protective layer, forming a second contact hole exposing a surface of the fourth conductor layer in the first and second insulator layers, forming a conductive material layer containing a prescribed metal in the second contact hole and simultaneously heat-treating the same thereby forming a fifth conductor layer containing a compound of the silicon contained in the fourth conductor layer and the aforementioned prescribed metal, forming a sixth conductor layer containing a metal or a compound of this metal on the fifth conductor layer in the second contact hole, and forming a second conductor region electrically connected with the sixth conductor layer on the second insulator layer.

[0087] In this case, the depth of the second contact hole is reduced by a value corresponding to the thickness of the fourth conductor layer and the aspect ratio thereof is also reduced in formation of the second contact hole in the first and second insulator layers as compared with the case of forming a contact hole directly exposing the surface of the second impurity region. Thus, the second contact hole can be formed in a shorter time. Even if the first conductor region is exposed due to misalignment or the like in formation of the second contact hole, therefore, the surface of the first conductor region can be inhibited from exposure resulting from excessive etching of the first protective layer. Consequently, the first and second conductor regions can be prevented from an electrical short by the fifth and sixth conductor layers formed in the second contact hole.

[0088] According to a fourth preferred aspect of the inventive method of fabricating a semiconductor device, the step of forming the pair of source/drain regions includes the steps of forming the first and second impurity regions, and the step of forming the gate electrode includes a step of forming the same on a region of the semiconductor substrate held between the first and second impurity regions.

[0089] In this case, a MOS transistor is so formed that the first and second conductor regions are connected to the first and second ones of the pair of source/drain regions respectively. Further, the first and second conductor regions can be prevented from an electrical short.

[0090] According to a fifth preferred aspect of the inventive method of fabricating a semiconductor device, a silicon nitride film is employed as the first protective layer, and a silicon oxide film is employed as the second insulator layer.

[0091] In this case, the silicon oxide film can be readily selectively etched while substantially leaving the silicon nitride film in formation of the second contact hole. Thus, the surface of the first conductor region can be effectively inhibited from exposure.

[0092] According to a sixth preferred aspect of the present invention, the method of fabricating a semiconductor device further includes steps of forming a first region including the first and second impurity regions, forming a second region which is electrically insulated from the first region on the major surface of the semiconductor substrate, and forming a third impurity region on a major surface of the second region in advance of the step of forming the first insulator layer. The method further includes steps of forming a third contact hole exposing a surface of the third impurity region in the first and second insulator layers, forming a first columnar conductor in the third contact hole, forming a third insulator layer on the second insulator layer to cover surfaces of the second conductor region and the first columnar conductor, forming fourth and fifth contact holes exposing surfaces of the first columnar conductor and the second conductor region respectively in the third insulator layer, forming a second columnar conductor in the fourth contact hole, forming a third columnar conductor in the fifth contact hole, and forming first and second wiring layers which are electrically connected with the third and second columnar conductors respectively on the third insulator layer in advance of the step of forming the first insulator layer.

[0093] In this case, the third and fourth contact holes have depths corresponding to the thickness of the first and second insulator layers and that of the third insulator layer respectively. As compared with the case of forming a contact hole directly exposing a surface of the third impurity region in the first to third insulator layers, therefore, the aspect ratios of the third and fourth contact holes are reduced respectively. Thus, the third and fourth contact holes can be readily formed respectively. Consequently, the third and fourth contact holes are inhibited from defective opening, and the electrical connection between the second wiring layer and the third impurity region is improved. In simultaneous formation of the fourth and fifth contact holes, the part of the surface of the second conductor region exposed on the bottom of the fifth contact hole is thereafter exposed to etching gas for a time corresponding to that up to exposure of the surface of the first columnar conductor on the bottom of the fourth contact hole. As compared with the case of forming a contact hole directly exposing the surface of the third impurity region, therefore, the time for exposing the exposed part to the etching gas is reduced. Thus, the fifth contact hole can be inhibited from partially passing through the second conductor region due to excessive etching of the second conductor region. Consequently, the electrical connection between the first wiring layer and the second conductor region is improved.

[0094] According to a seventh preferred aspect of the present invention, the method of fabricating a semiconductor device further includes a step of forming a relay conductor, which is electrically connected with the first columnar conductor, having a larger sectional area than the first columnar conductor on the second insulator layer between the steps of forming the first and second columnar conductors.

[0095] In this case, the depth of the fourth contact hole is reduced by a value corresponding to the thickness of the relay conductor. Thus, the aspect ratio of the fourth contact hole is further reduced, so that the fourth contact hole can be further readily opened. Further, the relay conductor has a larger sectional area than the first columnar conductor, whereby its surface can be reliably exposed even if misalignment is caused in photolithography in formation of the fourth contact hole. Thus, the electrical connection between the second wiring layer and the third impurity region is further improved.

[0096] According to an eighth preferred aspect of the inventive method of fabricating a semiconductor device, the step of forming the relay conductor is carried out simultaneously with the step of forming the second conductor region.

[0097] In this case, the relay conductor can be readily formed simultaneously with formation of the second conductor region, with no requirement for an additional step for forming the relay conductor.

[0098] According to a ninth preferred aspect of the present invention, the method of fabricating a semiconductor device further includes steps of forming a plurality of element forming regions and an element isolation region electrically insulating the element forming regions from each other in the first region, forming a first gate electrode portion extending on each element forming region and a second gate electrode, which is connected with the first gate electrode portion, extending on the element isolation region as the gate electrode, and forming a second protective layer to cover the gate electrode in advance of the step of forming the first insulator layer. The method further includes steps of forming an opening exposing a surface of the second protective layer on the first insulator layer located on each element forming region including a portion on the first gate electrode portion and exposing a surface of the element forming region including the first gate electrode portion by removing the exposed part of the second protective layer.

[0099] In this case, an opening having a relatively large opening area can be formed in the first insulator layer located in the element forming region. In other words, an opening having a reduced aspect ratio can be formed. Thus, a part of the second protective layer, which is formed to cover the gate electrode at first, covering the first gate electrode portion in the element forming region in particular is excessively etched so that only the second protective layer is exposed on the bottom of the opening without exposing the first gate electrode portion. When the exposed part of the second protective layer is thereafter removed, the surfaces of the first and second impurity regions are exposed substantially with no etching of the first gate electrode portion extending on each element forming region. The remaining part of the second protective layer covering the second gate electrode portion extending on the element isolation region is left unremoved. Thus, the electrical isolation between insulation the first and second conductor regions formed on the element forming region and the gate electrode is improved, and the electrical connection between the source/drain regions of the MOS transistor and the first and second conductor regions is also improved.

[0100] According to a tenth preferred aspect of the inventive method of fabricating a semiconductor device, a silicon nitride film is employed as the second protective layer, and a silicon oxide film is employed as the first insulator layer.

[0101] In this case, the silicon oxide film can be readily selectively removed while substantially leaving the silicon nitride film.

[0102] According to an eleventh preferred aspect of the inventive method of fabricating a semiconductor device, a silicon substrate is employed as the semiconductor substrate, and the step of forming the first conductor layer includes a step of forming a layer of silicon or a silicon-germanium alloy.

[0103] In this case, the first conductor layer can be readily formed on a prescribed region of the semiconductor substrate in self alignment. Further, contact resistance between the first conductor layer and the semiconductor substrate can be reduced.

[0104] According to a twelfth preferred aspect of the inventive method of fabricating a semiconductor device, a metal selected from a group consisting of titanium, cobalt, zirconium and hafnium is employed as the metal.

[0105] In this case, the silicon contained in the first conductor layer and the metal readily cause silicide reaction in formation of the second conductor layer, to readily form metal silicide.

[0106] The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0107]FIG. 1 is a cross sectional view showing a DRAM according to an embodiment 1 of the present invention;

[0108]FIG. 2 is a cross sectional view showing a step in a method of fabricating a DRAM according to an embodiment 2 of the present invention;

[0109]FIG. 3 is a cross sectional view showing a step carried out after that shown in FIG. 2 in the embodiment 2 of the present invention;

[0110]FIG. 4 is a cross sectional view showing a step carried out after that shown in FIG. 3 in the embodiment 2 of the present invention;

[0111]FIG. 5 is a cross sectional view showing a step carried out after that shown in FIG. 4 in the embodiment 2 of the present invention;

[0112]FIG. 6 is a cross sectional view showing a step carried out after that shown in FIG. 5 in the embodiment 2 of the present invention;

[0113]FIG. 7 is a cross sectional view showing a step carried out after that shown in FIG. 6 in the embodiment 2 of the present invention;

[0114]FIG. 8 is a partially enlarged cross sectional view of the step shown in FIG. 7 in the embodiment 2 of the present invention;

[0115]FIG. 9 is a partially enlarged cross sectional view showing a step carried out after that shown in FIG. 8 in the embodiment 2 of the present invention;

[0116]FIG. 10 is a cross sectional view showing a step carried out after that shown in FIG. 9 in the embodiment 2 of the present invention;

[0117]FIG. 11 is a cross sectional view showing a step carried out after that shown in FIG. 10 in the embodiment 2 of the present invention;

[0118]FIG. 12 is a cross sectional view showing a step carried out after that shown in FIG. 11 in the embodiment 2 of the present invention;

[0119]FIG. 13 is a cross sectional view showing a step carried out after that shown in FIG. 12 in the embodiment 2 of the present invention;

[0120]FIG. 14 is a cross sectional view showing a step carried out after that shown in FIG. 13 in the embodiment 2 of the present invention;

[0121]FIG. 15 is a cross sectional view showing a step carried out after that shown in FIG. 14 in the embodiment 2 of the present invention;

[0122]FIG. 16 is a cross sectional view showing a step carried out after that shown in FIG. 15 in the embodiment 2 of the present invention;

[0123]FIG. 17 is a cross sectional view showing a step carried out after that shown in FIG. 16 in the embodiment 2 of the present invention;

[0124]FIG. 18 is a cross sectional view showing a DRAM according to an embodiment 3 of the present invention;

[0125]FIG. 19 is a cross sectional view showing a step in a method of fabricating a DRAM according to an embodiment 4 of the present invention;

[0126]FIG. 20 is a cross sectional view showing a step carried out after that shown in FIG. 19 in the embodiment 4 of the present invention;

[0127]FIG. 21 is a cross sectional view showing a step carried out after that shown in FIG. 20 in the embodiment 4 of the present invention;

[0128]FIG. 22 is a cross sectional view showing a step carried out after that shown in FIG. 21 in the embodiment 4 of the present invention;

[0129]FIG. 23 is a cross sectional view showing a step carried out after that shown in FIG. 22 in the embodiment 4 of the present invention;

[0130]FIG. 24 is a cross sectional view showing a step carried out after that shown in FIG. 23 in the embodiment 4 of the present invention;

[0131]FIG. 25 is a cross sectional view showing a step carried out after that shown in FIG. 24 in the embodiment 4 of the present invention;

[0132]FIG. 26 is a cross sectional view showing a step carried out after that shown in FIG. 25 in the embodiment 4 of the present invention;

[0133]FIG. 27 is a cross sectional view showing a DRAM according to an embodiment 5 of the present invention;

[0134]FIG. 28 is a cross sectional view showing a step in a method of fabricating a DRAM according to an embodiment 6 of the present invention;

[0135]FIG. 29 is a cross sectional view showing a step carried out after that shown in FIG. 28 in the embodiment 6 of the present invention;

[0136]FIG. 30 is a cross sectional view showing a step carried out after that shown in FIG. 29 in the embodiment 6 of the present invention;

[0137]FIG. 31 is a cross sectional view showing a step carried out after that shown in FIG. 30 in the embodiment 6 of the present invention;

[0138]FIG. 32 is a cross sectional view showing a step carried out after that shown in FIG. 31 in the embodiment 6 of the present invention;

[0139]FIG. 33 is a cross sectional view showing a step carried out after that shown in FIG. 32 in the embodiment 6 of the present invention;

[0140]FIG. 34 is a cross sectional view showing a step carried out after that shown in FIG. 33 in the embodiment 6 of the present invention;

[0141]FIG. 35 is a partially enlarged cross sectional view of the step shown in FIG. 34 in the embodiment 6 of the present invention;

[0142]FIG. 36 is a cross sectional view showing a step carried out after that shown in FIG. 34 in the embodiment 6 of the present invention;

[0143]FIG. 37 is a cross sectional view showing a step carried out after that shown in FIG. 36 in the embodiment 6 of the present invention;

[0144]FIG. 38 is a cross sectional view showing a DRAM according to an embodiment 7 of the present invention;

[0145]FIG. 39 is a cross sectional view showing a step in a method of fabricating a DRAM according to an embodiment 8 of the present invention;

[0146]FIG. 40 is a cross sectional view showing a step carried out after that shown in FIG. 39 in the embodiment 8 of the present invention;

[0147]FIG. 41 is a cross sectional view showing a step carried out after that shown in FIG. 40 in the embodiment 8 of the present invention;

[0148]FIG. 42 is a cross sectional view showing a step carried out after that shown in FIG. 41 in the embodiment 8 of the present invention;

[0149]FIG. 43 is a cross sectional view showing a step carried out after that shown in FIG. 42 in the embodiment 8 of the present invention;

[0150]FIG. 44 is a cross sectional view showing a step carried out after that shown in FIG. 43 in the embodiment 8 of the present invention;

[0151]FIG. 45 is a cross sectional view showing a step carried out after that shown in FIG. 44 in the embodiment 8 of the present invention;

[0152]FIG. 46 is a cross sectional view showing a step carried out after that shown in FIG. 45 in the embodiment 8 of the present invention;

[0153]FIG. 47 is a cross sectional view showing a step carried out after that shown in FIG. 46 in the embodiment 8 of the present invention;

[0154]FIG. 48 is a cross sectional view showing a step carried out after that shown in FIG. 47 in the embodiment 8 of the present invention;

[0155]FIG. 49 is a cross sectional view showing a step carried out after that shown in FIG. 48 in the embodiment 8 of the present invention;

[0156]FIG. 50 is a plan view of the step shown in FIG. 42 in the embodiment 8 of the present invention;

[0157]FIG. 51 is a cross sectional view taken along the line L2-L2 in FIG. 50;

[0158]FIG. 52 is a cross sectional view showing a step carried out after that shown in FIG. 51 in the embodiment 8 of the present invention;

[0159]FIG. 53 is a cross sectional view showing a step carried out after that shown in FIG. 52 in the embodiment 8 of the present invention;

[0160]FIG. 54 is a cross sectional view showing a step in a method of fabricating a DRAM according to first prior art;

[0161]FIG. 55 is a cross sectional view showing a step carried out after that shown in FIG. 54;

[0162]FIG. 56 is a cross sectional view showing a step carried out after that shown in FIG. 55;

[0163]FIG. 57 is a cross sectional view showing a step carried out after that shown in FIG. 56;

[0164]FIG. 58 is a cross sectional view showing a step carried out after that shown in FIG. 57;

[0165]FIG. 59 is a cross sectional view showing a step carried out after that shown in FIG. 58;

[0166]FIG. 60 is a cross sectional view showing a step carried out after that shown in FIG. 59;

[0167]FIG. 61 is a cross sectional view showing a step carried out after that shown in FIG. 60;

[0168]FIG. 62 is a cross sectional view showing a step carried out after that shown in FIG. 61;

[0169]FIG. 63 is a cross sectional view showing a step carried out after that shown in FIG. 62;

[0170]FIG. 64 is a cross sectional view showing a step carried out after that shown in FIG. 63;

[0171]FIG. 65 is a cross sectional view showing a step carried out after that shown in FIG. 64;

[0172]FIG. 66 is a cross sectional view showing a step carried out after that shown in FIG. 65;

[0173]FIG. 67 is a cross sectional view showing a step carried out after that shown in FIG. 66;

[0174]FIG. 68 is a cross sectional view showing a step carried out after that shown in FIG. 67;

[0175]FIG. 69 is a cross sectional view showing a step carried out after that shown in FIG. 68;

[0176]FIG. 70 is a cross sectional view showing a step carried out after that shown in FIG. 69;

[0177]FIG. 71 is a cross sectional view showing a step carried out after that shown in FIG. 70;

[0178]FIG. 72 is a cross sectional view showing a step carried out after that shown in FIG. 71;

[0179]FIG. 73 is a cross sectional view showing a step carried out after that shown in FIG. 72;

[0180]FIG. 74 is a cross sectional view showing a step carried out after that shown in FIG. 73;

[0181]FIG. 75 is a cross sectional view showing a step carried out after that shown in FIG. 74;

[0182]FIG. 76 is a partially enlarged cross sectional view of the step shown in FIG. 75;

[0183]FIG. 77 is a partially enlarged cross sectional view showing a step carried out after that shown in FIG. 76;

[0184]FIG. 78 is a cross sectional view showing the DRAM according to the first prior art;

[0185]FIG. 79 is a cross sectional view showing a step in a method of fabricating a DRAM according to second prior art;

[0186]FIG. 80 is a cross sectional view showing a step carried out after that shown in FIG. 79;

[0187]FIG. 81 is a cross sectional view showing a step carried out after that shown in FIG. 80;

[0188]FIG. 82 is a cross sectional view showing a step carried out after that shown in FIG. 81;

[0189]FIG. 83 is a cross sectional view showing a step carried out after that shown in FIG. 82;

[0190]FIG. 84 is a cross sectional view showing a step carried out after that shown in FIG. 83;

[0191]FIG. 85 is a cross sectional view showing a step carried out after that shown in FIG. 84;

[0192]FIG. 86 is a cross sectional view of the DRAM according to the second prior art;

[0193]FIG. 87 is a plan view of the step shown in FIG. 80;

[0194]FIG. 88 is a cross sectional view taken along the line L4-L4 in FIG. 84;

[0195]FIG. 89 is a plan view of the step shown in FIG. 84; and

[0196]FIG. 90 is a cross sectional view taken along the line L6-L6 in FIG. 89.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0197] Embodiment 1

[0198] A DRAM according to an embodiment 1 of the present invention is now described with reference to FIG. 1. Referring to FIG. 1, a memory cell region 1 a serving as a first region and a peripheral circuit region 1 b serving as a second or third region, which are electrically insulated from each other by an element isolation oxide film 2 a, are formed on a silicon substrate 1. A p-type well 3 a is formed in the memory cell region 1 a. A p-type well 3 b and an n-type well 4, which are electrically insulated from each other by an element isolation oxide film 2 b, is formed in the peripheral circuit region 1 b.

[0199] A pair of n-type source/drain regions 15 a and 15 b are formed in the p-type well 3 a at a prescribed space. A gate electrode portion 8 a is formed on a region held between the pair of n-type source/drain regions 15 a and 15 b with a gate oxide film interposed. The pair of n-type source/drain regions 15 a and 15 b and the gate electrode portion 8 a form an n-channel MOS transistor T1. Sidewall oxide films are formed on both side surfaces of the gate electrode portion 8 a.

[0200] A pair of n-type source/drain regions 15 c and 15 d are formed in the p-type well 3 b at a prescribed space. A gate electrode portion 8 b is formed on a region held between the pair of n-type source/drain regions 15 c and 15 d with a gate oxide film interposed. The pair of n-type source/drain regions 15 c and 15 d and the gate electrode portion 8 b form an n-channel MOS transistor T2.

[0201] A pair of p-type source/drain regions 16 a and 16 b are formed in the n-type well 4 at a prescribed space. A gate electrode portion 8 c is formed on a region held between the pair of p-type source/drain regions 16 a and 16 b with a gate oxide film interposed. The pair of p-type source/drain regions 16 a and 16 b and the gate electrode portion 8 c form a p-channel MOS transistor T3.

[0202] A silicon oxide film 17 is formed on the silicon substrate 1 to cover the MOS transistors T1, T2 and T3. A bit line contact hole 18 a, a storage node contact hole 19 a and peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d are formed in the silicon oxide film 17. Conductor layers are formed in the bit line contact hole 18 a and the storage node contact hole 19 a respectively.

[0203] Namely, a polysilicon film 20 a, a titanium silicide film 24 a and a titanium nitride film 23 a serving as first, second and third conductor layers respectively are formed in the bit line contact hole 18 a. On the other hand, a polysilicon film 20 b, a titanium silicide film 24 b and a titanium nitride film 23 b serving as first, second and third conductor layers respectively are formed in the storage node contact hole 19 a.

[0204] Titanium silicide films 24 c, 24 d, 24 e and 24 f and titanium nitride films 23 c, 23 d, 23 e and 23 f are formed in the peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d respectively. A bit line 25 serving as a first conductor region is formed on the silicon oxide film 17. A silicon oxide film 26 is formed on the silicon oxide film 17, to cover the bit line 25. A storage node contact hole 19 b is formed in the silicon oxide film 26. A titanium nitride film 27 a is formed in the storage node contact hole 19 b.

[0205] A storage node 28 a is formed on the silicon oxide film 26. A cell plate 28 c is formed on the storage node 28 a with a capacitor dielectric film 28 b interposed. The storage node 28 a, the capacitor dielectric film 28 b and the cell plate 28 c form a capacitor 28 serving as a first or second conductor region. An interlayer insulation film 29 is formed on the silicon oxide film 26, to cover the capacitor 28.

[0206] A cell plate contact hole 30 serving as a fifth or eighth contact hole exposing a surface of the cell plate 28 c is formed in the interlayer insulation film 29. Further, peripheral circuit contact holes 31 a, 31 b, 31 c and 31 d are formed to expose surfaces of the titanium nitride films 23 c, 23 d, 23 e and 23 f respectively.

[0207] A titanium nitride film 32 a is formed in the cell plate contact hole 30. Titanium nitride films 32 b, 32 c, 32 d and 32 e are formed in the peripheral circuit contact holes 31 a, 31 b, 31 c and 31 d respectively. Metal wires 33 serving as first, second and third wiring layers are formed on the interlayer insulation film 29.

[0208] In the aforementioned DRAM, the titanium silicide films 24 a and 24 b in the bit line contact hole 18 a and the storage node contact hole 19 a are formed by reacting titanium and silicon by heat treatment, as described later. At this time, the polysilicon films 20 a and 20 b are present between the n-type source/drain regions 15 a and 15 b and the titanium. Thus, the titanium reacts with the silicon contained in the polysilicon films 20 a and 20 b, and can be prevented from reacting with the silicon contained in the n-type source/drain regions 15 a and 15 b. Consequently, leakage currents leaking from the n-type source/drain regions 15 a and 15 b to the semiconductor substrate 1 can be reduced.

[0209] Further, the titanium nitride films 23 a, 23 b and 27 a are also formed in the bit line contact hole 18 a and the storage node contact holes 19 a and 19 b respectively. Thus, the electrical resistance between the bit line 25 and the n-type source/drain region 15 b and that between the storage node 28 a of the capacitor 28 and the n-type source/drain region 15 a are reduced. Consequently, the memory cell region 1 a attains a high-speed operation, and the speed of the overall DRAM including the peripheral circuit region 1 b is improved.

[0210] As contact holes in the peripheral circuit region 1 b, the peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d are formed in the silicon oxide film 17 and the peripheral circuit contact holes 31 a, 31 b, 31 c and 31 d are formed in the interlayer insulation film 29 and the silicon oxide film 26. As compared with the case of forming contact holes in the interlayer insulation film 29 and the silicon oxide films 17 and 26 through a single step, therefore, the aspect ratios of the respective peripheral circuit contact holes 21 a to 21 d and 31 a to 31 d are further reduced so that the peripheral circuit contact holes 21 a to 21 d and 31 a to 31 d can be readily formed.

[0211] When the cell plate contact hole 30 and the peripheral circuit contact holes 31 a, 31 b, 31 c and 31 d are simultaneously formed, a surface of the cell plate 28 c is exposed on the bottom of the cell plate contact hole 30 in advance. The exposed surface of the cell plate 28 c is exposed to plasma for a time corresponding to that required for etching up to exposure of surfaces of the titanium nitride films 23 c, 23 d, 23 e and 23 f buried in the peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d. As compared with the case of forming contact holes exposing surfaces of the n- and p-type source/drain regions 15 a, 15 b, 16 a and 16 b, therefore, the time for exposing the cell plate 28 c to the plasma is reduced. Thus, the cell plate 28 c can be prevented from being damaged by the etching, or the cell plate contact hole 30 can be prevented from passing through the cell plate 28 c.

[0212] Consequently, the electrical connection between an element such as the capacitor 28 formed on the memory cell region 1 a and elements such as the MOS transistors T2 and T3 formed in the peripheral circuit region 1 b is improved.

[0213] While the polysilicon films 20 a and 20 b are formed in the bit line contact hole 18 a and the storage node contact hole 19 a as first conductor layers respectively in this embodiment, a similar effect can be attained by forming films of epitaxial silicon or an epitaxial silicon-germanium alloy in place of the polysilicon films 20 a and 20 b.

[0214] Further, the metal reacting with the silicon to readily form a silicide compound may be prepared from cobalt, zirconium or hafnium, in place of titanium.

[0215] Embodiment 2

[0216] As an embodiment 2 of the present invention, an exemplary method of fabricating the DRAM according to the embodiment 1 of the present invention is now described with reference to FIGS. 2 to 17.

[0217] Steps up to that shown in FIG. 2 are similar to those of the prior art shown in FIGS. 54 to 64, and hence redundant description is omitted.

[0218] Referring to FIG. 3, a storage node contact hole 19 a and a bit line contact hole 18 a exposing surfaces of the n-type source/drain regions 15 a and 15 b respectively are formed in a silicon oxide film 17.

[0219] Referring to FIG. 4, a polysilicon film 20 is formed on the silicon oxide film 17 to fill up the storage node contact hole 19 a and the bit line contact hole 18 a.

[0220] Referring to FIG. 5, the polysilicon film 20 is so etched as to leave polysilicon films 20 a and 20 b only in the vicinity of the bottoms of the bit line contact hole 18 a and the storage node contact hole 19 a respectively. At this time, the polysilicon films 20 a and 20 b are preferably 50 to 200 nm in thickness. The thickness of the polysilicon films 20 a and 20 b can be readily controlled by adjusting the etching time for the polysilicon film 20.

[0221] Referring to FIG. 6, a prescribed photoresist film (not shown) is formed on the silicon oxide film 17 and employed as a mask for forming peripheral circuit contact holes 21 a and 21 b exposing surfaces of n-type source/drain regions 15 d and 15 c respectively in the silicon oxide film 17, while forming peripheral contact holes 21 c and 21 d exposing surfaces of p-type source/drain regions 16 a and 16 b respectively.

[0222] Referring to FIG. 7, a titanium film is formed on the silicon oxide film 17 by sputtering or the like. At this time, titanium films 22 a and 22 b are formed on the polysilicon films 20 a and 20 b in the bit line contact hole 18 a and the storage node contact hole 19 a respectively. Titanium films 22 c, 22 d, 22 e and 22 f are formed on the n-type source/drain regions 15 d and 15 c and the p-type source/drain regions 16 a and 16 b exposed on the bottoms of the peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d respectively. Referring to FIG. 7, the titanium film formed on the silicon oxide film 17 and side surfaces of the bit line contact hole 18 a is omitted.

[0223] Thereafter titanium nitride films are formed on the titanium films 22 a to 22 f. At this time, titanium nitride films 23 a, 23 b, 23 c, 23 d, 23 e and 23 f are formed on the titanium films 22 a, 22 b, 22 c, 22 d, 22 e and 22 f respectively. FIG. 8 is a partially enlarged view showing the bit line contact hole 18 a, the storage node contact hole 19 a and the peripheral circuit contact holes 21 a and 21 d in this step.

[0224] Referring to FIG. 9, heat treatment is performed in a nitrogen atmosphere at a temperature of 600 to 800° C. for 30 to 60 seconds to react the titanium films 22 a and 22 b with the polysilicon films 20 a and 20 b, thereby forming titanium silicide films 24 a and 24 b while reacting the titanium films 22 c and 22 f with the silicon contained in the n-type source/drain region 15 d and the p-type source/drain region 16 b respectively thereby forming titanium silicide films 24 c and 24 f. At this time, titanium silicide films 24 d and 24 e are also formed on the bottoms of the peripheral circuit contact holes 21 b and 21 c respectively.

[0225] While the titanium film 23 a and the like are left only in the interior of the bit line contact hole 18 a and the like in the step shown in FIG. 7, the titanium nitride film 23 a and the like may be left by performing etching after the heat treatment in the step shown in FIG. 9.

[0226] Referring to FIG. 10, a bit line 25 which is electrically connected with the titanium nitride film 23 a is formed. A silicon oxide film 26 is formed on the silicon oxide film 17 to cover the bit line 25.

[0227] Referring to FIG. 11, a storage node contact hole 19 b exposing a surface of the titanium nitride film 23 b is formed in the silicon oxide film 26.

[0228] Referring to FIG. 12, a titanium nitride film 27 a is buried in the storage node contact hole 19 b.

[0229] Referring to FIG. 13, a metal film of ruthenium or platinum is formed on the silicon oxide film 26, and a storage node 28 a which is electrically connected to the titanium nitride film 27 a is formed by prescribed photolithography and etching.

[0230] Referring to FIG. 14, a thin film of a high dielectric constant and a metal film of ruthenium or platinum are successively formed on the storage node 28 a. Thereafter a capacitor dielectric film 28 b and a cell plate 28 c are formed by prescribed photolithography and etching. The storage node 28 a, the capacitor dielectric film 28 b and the cell plate 28 c form a capacitor 28.

[0231] Referring to FIG. 15, an interlayer insulation film 29 is formed on the silicon oxide film 26, to cover the capacitor 28.

[0232] Referring to FIG. 16, peripheral circuit contact holes 31 a, 31 b, 31 c and 31 d exposing surfaces of the titanium nitride films 23 c, 23 d, 23 e and 23 f respectively are formed in the interlayer insulation film 29 and the silicon oxide film 26. At the same time, a cell plate contact hole 30 exposing a surface of the cell plate 28 c of the capacitor 28 is formed in the interlayer insulation film 29.

[0233] Referring to FIG. 17, a titanium nitride film 32 a is formed in the cell plate contact hole 30 by sputtering or the like. Further, titanium nitride films 32 b, 32 c, 32 d and 32 e are formed in the peripheral circuit contact holes 31 a, 31 b, 31 c and 31 d respectively. Then, an aluminum copper film is formed on the interlayer insulation film 29, and metal wires 33 are formed by prescribed photolithography and etching. Thereafter an interlayer insulation film (not shown) and a passivation film (not shown) are formed to cover the metal wires 33, thereby completing the DRAM.

[0234] According to this fabrication method, the titanium silicide films 24 a and 24 b are formed in the bit line contact hole 18 a and the storage node contact hole 19 a respectively by reacting titanium with silicon by the heat treatment. At this time, the titanium reacts with the silicon contained in the polysilicon films 20 a and 20 b, to be capable of being prevented from reacting with the silicon contained in the n-type source/drain regions 15 a and 15 b. Consequently, leakage currents leaking from the n-type source/drain regions 15 a and 15 b to the semiconductor substrate 1 can be reduced.

[0235] Further, the peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d are formed in the silicon oxide film 17, while the peripheral circuit contact holes 31 a, 31 b, 31 c and 31 d are formed in the interlayer insulation film 29 and the silicon oxide film 26. As compared with the case of forming peripheral circuit contact holes in the interlayer insulation film 29 and the silicon oxide films 17 and 26 through a single step, therefore, the aspect ratios of the peripheral circuit contact holes 21 a to 21 d and 31 a to 31 d are so reduced that the peripheral circuit contact holes 21 a to 21 d and 31 a to 31 d can be readily opened.

[0236] When the cell plate contact hole 30 and the peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d are simultaneously formed, the surface of the cell plate 28 c is exposed on the bottom of the cell plate contact hole 30 in advance. The exposed surface of the cell plate 28 c is exposed to plasma for a time corresponding to that required for etching up to exposure of the surfaces of the titanium nitride films 23 c, 23 d, 23 e and 23 e which are buried in the peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d respectively. As compared with the case of forming contact holes exposing the surfaces of the n- and p-type source/drain regions 15 a, 15 b, 16 a and 16 b, therefore, the time for exposing the surface of the cell plate 28 c to the plasma is reduced. Thus, the cell plate 28 c can be prevented from damage resulting from the etching or the cell plate contact hole 30 can be prevented from passing through the cell plate 28 c.

[0237] Consequently, electrical connection between an element such as the capacitor 28 formed in the memory cell region 1 a and elements such as the MOS transistors T2 and T3 formed in the peripheral circuit region 1 b is improved.

[0238] While the polysilicon films 20 a and 20 b are formed on the bottoms of the bit line contact hole 18 a and the storage node contact hole 19 a respectively, epitaxial silicon films may be formed in place of the polysilicon films 20 a and 20 b. In this case, the silicon substrate 1 is exposed to an atmosphere of monosilane gas or disilane gas under a temperature of 500 to 550° C., to form amorphous silicon. Thereafter heat treatment is performed in a nitrogen atmosphere at a temperature of 550 to 650° C. for 2 to 5 hours, for forming the epitaxial silicon films by solid-phase growth of the amorphous silicon.

[0239] In the step shown in FIG. 4, films of epitaxial silicon or an epitaxial silicon-germanium alloy may be selectively formed only on the bottoms of the bit line contact hole 18 a and the storage node contact hole 19 by selective epitaxy. Also in this case, the n-type source/drain regions 15 a and 15 b are inhibited from being influenced by the heat treatment, and an effect similar to that described with reference to the embodiment 1 can be attained.

[0240] Embodiment 3

[0241] A DRAM according to an embodiment 3 of the present invention is now described with reference to FIG. 18. Referring to FIG. 18, peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d are formed in a silicon oxide film 17 in a peripheral circuit region 1 b, and peripheral circuit contact holes 34 a, 34 b, 34 c and 34 d are formed in a silicon oxide film 26. Conductors 35 a, 35 b, 35 c and 35 d serving as relay conductors are formed on the silicon oxide film 26. The conductors 35 a, 35 b, 35 c and 35 d are formed by the same films as a metal film of ruthenium or platinum which is formed on the silicon oxide film 26 for forming a storage node 28 a of a capacitor 28.

[0242] Peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d are formed in an interlayer insulation film 29 to expose surfaces of the conductors 35 a, 35 b, 35 c and 35 d respectively. The remaining structure of the DRAM shown in FIG. 18 is identical to that of the DRAM shown in FIG. 1 described with reference to the embodiment 1, and hence members identical to those in FIG. 1 are denoted by the same reference numerals, to omit redundant description.

[0243] In addition to an effect of reducing leakage currents, the aforementioned DRAM attains the following effect in fabrication: Particularly in the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d, the depth thereof is reduced by a value corresponding to the thickness of the conductors 35 a, 35 b, 35 c and 35 d. As compared with the structure shown in FIG. 1 described with reference to the embodiment 1, therefore, the aspect ratio of the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d is further reduced. Consequently, the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d can be further readily opened.

[0244] When a cell plate contact hole 30 and the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d are simultaneously formed, surfaces of the conductors 35 a, 35 b, 35 c and 35 d are exposed in advance of that of a cell plate 28 c. Thus, damage of the cell plate 28 c resulting from etching is remarkably reduced, and the cell plate contact hole 30 can be inhibited from passing through the cell plate 28 c.

[0245] Consequently, electrical connection between an element such as the capacitor 28 formed in a memory cell region 1 a and elements such as MOS transistors T2 and T3 formed in the peripheral circuit region 1 b is improved.

[0246] Embodiment 4

[0247] As an embodiment 4 of the present invention, an exemplary method of fabricating the DRAM according to the embodiment 3 is now described with reference to FIGS. 19 to 26.

[0248] Steps up to that shown in FIG. 19 are similar to those of the embodiment 2 up to the step shown in FIG. 10, and hence redundant description is omitted.

[0249] Referring to FIG. 20, a storage node contact hole 19 b exposing a surface of a titanium nitride film 23 b is formed in a silicon oxide film 26, while peripheral circuit contact holes 34 a, 34 b, 34 c and 34 d are formed to expose surfaces of titanium nitride films 23 c, 23 d, 23 e and 23 f respectively.

[0250] Referring to FIG. 21, a titanium nitride film 27 a is formed in the storage node contact hole 19 b. Titanium nitride films 27 b, 27 c, 27 d and 27 e are formed in the peripheral circuit contact holes 34 a, 34 b, 34 c and 34 d respectively.

[0251] Referring to FIG. 22, a metal film of ruthenium or platinum is formed on the silicon oxide film 26, and a storage node 28 a is formed by prescribed photolithography and etching. At the same time, conductors 35 a, 35 b, 35 c and 35 d are formed on the titanium nitride films 27 b, 27 c, 27 d and 27 e respectively.

[0252] Referring to FIG. 23, a thin film of a high dielectric constant and a metal film of ruthenium or platinum are successively formed on the storage node 28 a. Thereafter a capacitor dielectric film 28 b and a cell plate 28 c are formed by prescribed photolithography and etching. The storage node 28 a, the capacitor dielectric film 28 b and the cell plate 28 c form a capacitor 28.

[0253] Referring to FIG. 24, an interlayer insulation film 29 is formed on the silicon oxide film 26, to cover the capacitor 28 and the conductors 35 a, 35 b, 35 c and 35 d.

[0254] Referring to FIG. 25, a cell plate contact hole 30 exposing a surface of the cell plate 28 c is formed in the interlayer insulation film 29. At the same time, peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d are formed to expose surfaces of the conductors 35 a, 35 b, 35 c and 35 d respectively.

[0255] Referring to FIG. 26, a titanium nitride film 32 a is formed in the cell plate contact hole 30 by sputtering or the like. Further, titanium nitride films 32 b, 32 c, 32 d and 32 e are formed in the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d respectively. Thereafter an aluminum copper film is formed on the interlayer insulation film 29. Metal wires 33 are formed by prescribed photolithography and etching. Thereafter an interlayer insulation film (not shown) and a passivation film (not shown) are formed to cover the metal wires 33, thereby completing the DRAM.

[0256] In addition to an effect of reducing leakage currents, this fabrication method attains the following effect: Particularly in the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d, the depth thereof is reduced by a value corresponding to the thickness of the conductors 35 a, 35 b, 35 c and 35 d. As compared with the DRAM shown in FIG. 1 described with reference to the embodiment 1, therefore, the aspect ratio of the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d is further reduced. Consequently, the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d can be further readily opened.

[0257] When the cell plate contact hole 30 and the peripheral circuit contact holes 36 a, 36 b, 36 c and 36 d are simultaneously formed, a surface of the cell plate 28 c is exposed after those of the conductors 35 a, 35 b, 35 c and 35 d are exposed. Thus, damage of the cell plate 28 c resulting from etching is remarkably reduced, and the cell plate contact hole 30 can be inhibited from passing through the cell plate 28 c.

[0258] Consequently, electrical connection between an element such as the capacitor 28 formed in a memory cell region 1 a and elements such as MOS transistors T2 and T3 formed in the peripheral circuit region 1 b is improved.

[0259] Embodiment 5

[0260] A DRAM according to an embodiment 5 of the present invention is now described with reference to FIG. 27. Referring to FIG. 27, epitaxial silicon growth layers 37 a and 37 b serving as first and fourth conductor layers are formed on n-type source/drain regions 15 a and 15 b of a MOS transistor T1 in a memory cell region 1 a of the DRAM respectively. Storage node contact holes 19 a and 19 b serving as second contact holes and a bit line contact hole 18 a serving as a first contact hole exposing surfaces of the epitaxial silicon growth layers 37 a and 37 b respectively are formed in silicon oxide films 17 and 26. Titanium silicide films 38 a and 38 b and titanium nitride films 23 a and 23 b are formed in the bit line contact hole 18 a and the storage node contact hole 19 a respectively. The remaining structure of the DRAM shown in FIG. 27 is identical to that of the DRAM shown in FIG. 18 described with reference to the embodiment 3, and hence members identical to those shown in FIG. 18 are denoted by the same reference numerals, to omit redundant description.

[0261] In the aforementioned structure, the titanium silicide films 38 a and 38 b are formed by reacting titanium films 22 a and 22 b formed in the bit line contact hole 18 a and the storage node contact hole 19 a shown in FIG. 35 with the epitaxial silicon growth layers 37 b and 37 a by heat treatment, as described with reference to an embodiment 6 of the present invention. Therefore, the titanium films 22 a and 22 b can be prevented from reacting with silicon contained in n-type source/drain regions 15 a and 15 b. Consequently, leakage currents leaking from the n-type source/drain regions 15 a and 15 b to a silicon substrate 1 are reduced, as described with reference to the embodiment 2.

[0262] While the epitaxial silicon growth layers 37 a and 37 b are employed in this embodiment, a similar effect can be attained by selectively epitaxially growing layers of a silicon-germanium alloy on the n-type source/drain regions 15 a and 15 b.

[0263] Further, electrical connection between an element such as a capacitor 28 formed in a memory cell region 1 a and elements such as MOS transistors T2 and T3 formed in the peripheral circuit region 1 b is improved, as described with reference to the embodiment 1.

[0264] Embodiment 6

[0265] As the embodiment 6 of the present invention, an exemplary method of fabricating the DRAM according to the embodiment 5 is now described with reference to FIGS. 28 to 37.

[0266] Steps up to that shown in FIG. 28 are similar to those of the prior art described with reference to FIGS. 54 to 60, and hence redundant description is omitted.

[0267] Referring to FIG. 29, a photoresist film 48 e is formed on a silicon oxide film 11 in a peripheral circuit region 1 b. This photoresist film 48 e is employed as a mask to anisotropically etch the silicon oxide film 11, thereby forming sidewall oxide films 12 on both side surfaces of a gate electrode portion 8 a. Phosphorus is injected into a p-type well 3 a through the sidewall oxide films 12 and the gate electrode portion 8 a serving as masks, for forming n⁺ source/drain regions 13 a and 13 b. The n⁺ source/drain regions 13 a and 13 b and n⁻ source/drain regions 9 a and 9 b form n-type source/drain regions 15 a and 15 b.

[0268] Referring to FIG. 30, epitaxial silicon growth layers 37 a and 37 b are selectively formed on the n-type source/drain regions 15 a and 15 b by chemical vapor deposition or the like.

[0269] The vertical positions of the epitaxial silicon growth layers 37 a and 37 b, which are higher than that of the gate electrode portion 8 a in FIG. 30, are not restricted to those shown in FIG. 30 so far as the epitaxial silicon growth layers 37 a and 37 b are formed on the n-type source/drain regions 15 a and 15 b.

[0270] Referring to FIG. 31, a photoresist film 48 f is formed to cover a memory cell region 1 a. This photoresist film 48 f is employed as a mask to anisotropically etch the silicon oxide film 11, thereby forming sidewall oxide films 12 on both side surfaces of gate electrode portions 8 b and 8 c. Thereafter phosphorus is ion-implanted into a p-type well 3 b through the gate electrode portion 8 b and the sidewall oxide films 12 serving as masks, thereby forming n⁺ source/drain regions 13 c and 13 d. The n⁺ source/drain regions 13 c and 13 d and n⁻ source/drain regions 9 c and 9 d form n-type source/drain regions 15 c and 15 d.

[0271] On the other hand, boron is injected into an n-type well 4 through the gate electrode portion 8 c and the sidewall oxide films 12 serving as masks, thereby forming p⁺ source/drain regions 14 a and 14 b. The p⁺ source/drain regions 14 a and 14 b and p⁻ source/drain regions 10 a and 10 b form p-type source/drain regions 16 a and 16 c.

[0272] The n-type well 4 is covered with a resist film when phosphorus is ion-implanted into the p-type well 3 b, and the p-type well 3 b is covered with a resist film when boron is ion-implanted into the n-type well 4, as a matter of course.

[0273] Referring to FIG. 32, a silicon oxide film 17 is formed on a silicon substrate 1, to cover the epitaxial silicon growth layers 37 a and 37 b and the gate electrode portions 8 b and 8 c.

[0274] Referring to FIG. 33, a bit line contact hole 18 a exposing a surface of the epitaxial silicon growth layer 37 b is formed in the silicon oxide film 17. A storage node contact hole 19 a is formed to expose a surface of the epitaxial silicon growth layer 37 a. Further, peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d are formed to expose surfaces of the n-type source/drain regions 15 c and 15 d and the p-type source/drain regions 16 a and 16 b respectively.

[0275] Referring to FIGS. 34 and 35, titanium films 22 a, 22 b, 22 c, 22 d, 22 e and 22 f and titanium nitride films 23 a, 23 b, 23 c, 23 d, 23 e and 23 f are successively formed in the bit line contact hole 18 a, the storage node contact hole 19 a and the peripheral circuit contact holes 21 a, 21 b, 21 c and 21 d respectively by sputtering or the like.

[0276] Referring to FIG. 36, heat treatment is performed to react the titanium films 22 a and 22 b with silicon contained in the epitaxial silicon growth layers 37 b and 37 a, thereby forming titanium silicide films 38 a and 38 b. Further, the titanium films 22 c, 22 d, 22 e and 22 f are reacted with silicon contained in the n-type source/drain regions 15 d and 15 c and the p-type source/drain regions 16 a and 16 b, thereby forming titanium silicide films 24 c, 24 d, 24 e and 24 f respectively. Conditions for the heat treatment are preferably identical to those described with reference to the embodiment 2.

[0277] Thereafter steps similar to those shown in FIGS. 19 to 26 described with reference to the embodiment 4, thereby obtaining the structure shown in FIG. 37. Thereafter an interlayer insulation film (not shown) and a passivation film (not shown) are formed to cover metal wires 33, thereby completing the DRAM.

[0278] In addition to an effect of reducing leakage currents, the aforementioned fabrication method attains an effect of improving electrical connection between an element formed in the memory cell region 1 a and those formed in the peripheral circuit region 1 b, as described with reference to the embodiments 2 and 4. While the epitaxial silicon growth layers 37 a and 37 b are formed on the n-type source/drain regions 15 a and 15 b in this embodiment, layers of a silicon-germanium alloy may alternatively be selectively epitaxially grown.

[0279] Embodiment 7

[0280] A DRAM according to an embodiment 7 of the present invention is now described with reference to FIG. 38. Referring to FIG. 38, epitaxial silicon growth layers 37 a and 37 b serving as first and fourth conductor layers are formed on n-type source/drain regions 15 a and 15 b of a MOS transistor T1 in a memory cell region 1 a respectively. These epitaxial silicon growth layers 37 a and 37 b are formed to cover sidewall oxide films 12 which are formed on side surfaces of a gate electrode portion 8 a. A silicon nitride film 56 a serving as a second protective layer is formed to cover a gate electrode serving as a second gate electrode portion located on an element isolation insulator film 2 a. On the other hand, no silicon nitride film is formed on a gate electrode portion serving as a first gate electrode portion in an element forming region A.

[0281] A silicon oxide film 54 is formed to cover the epitaxial silicon growth layers 37 a and 37 b. A bit line contact hole 18 a serving as a first contact hole exposing a surface of the epitaxial silicon growth layer 37 b is formed in the silicon oxide film 54. A titanium silicide film 38 a and a titanium nitride film 23 a are formed in the bit line contact hole 18 a.

[0282] A bit line 25 serving as a first conductor region which is electrically connected with the titanium nitride film 23 a is formed on the silicon oxide film 54. A silicon nitride film 57 a serving as a first protective layer is formed on the bit line 25. A silicon oxide film 26 is formed on the silicon oxide films 54 and 17, to cover the silicon nitride film 57 a. A storage node contact hole 50 a serving as a second contact hole exposing a surface of the epitaxial silicon growth layer 37 a is formed in the silicon oxide films 26 and 54. A titanium silicide film 38 b and a titanium nitride film 52 a are formed in the storage node contact hole 50 a.

[0283] In a peripheral circuit region 1 b of the DRAM, on the other hand, peripheral circuit contact holes 58 a and 58 b exposing surfaces of n-type source/drain regions 15 d and 15 c respectively are formed in the silicon oxide films 26 and 17. Titanium silicide films 24 c and 24 d and titanium nitride films 52 b and 52 c are formed in the peripheral circuit contact holes 58 a and 58 b respectively. Further, peripheral circuit contact holes 58 c and 58 d are formed to expose surfaces of p-type source/drain regions 16 a and 16 b respectively. Titanium silicide films 24 e and 24 f and titanium nitride films 52 d and 52 e are formed in the peripheral circuit contact holes 58 c and 58 d respectively.

[0284] Peripheral circuit contact holes 59 a, 59 b, 59 c and 59 d exposing surfaces of the titanium nitride films 52 b, 52 c, 52 d and 52 e respectively are formed in an interlayer insulation film 29. Titanium nitride films 53 a, 53 b, 53 c and 53 d are formed in the peripheral circuit contact holes 59 a, 59 b, 59 c and 59 d respectively. The remaining structure of the DRAM shown in FIG. 38 is substantially identical to that of the DRAM shown in FIG. 27 described with reference to the embodiment 5, and hence members identical to those shown in FIG. 27 are denoted by the same reference numerals, to omit redundant description.

[0285] In the aforementioned structure, silicon contained in the n-type source/drain regions 15 a and 15 b is inhibited from being influenced by heat treatment for forming the titanium silicide films 38 a and 38 b, as described with reference to the embodiment 5. Namely, consumption of the silicon can be suppressed. Thus, currents leaking from the n-type source/drain regions 15 a and 15 b to a silicon substrate are reduced.

[0286] Further, the electrical resistance between the bit line 25 and the n-type source/drain region 15 b as well as that between a storage node 28 a and the n-type source/drain region 15 a are reduced, thereby improving the operating speed of the DRAM.

[0287] In addition to these effects, the aforementioned structure attains the following effect: The epitaxial silicon growth layers 37 a and 37 b are formed to extend over the gate electrode portion 8 a and the sidewall oxide films 12. Even if misalignment is caused in formation of the bit line contact hole 18 a, therefore, the sidewall oxide films 12 are inhibited from being etched in etching of the silicon oxide film 54. Therefore, no polysilicon film part of the gate electrode portion 8 a is exposed and an electrical short between the bit line 25 and the gate electrode portion 8 a can be prevented.

[0288] The sidewall oxide films 12 are also inhibited from being etched in formation of the storage node contact hole 50 a. On the other hand, the silicon nitride film 57 a covering the bit line 25 may be exposed in formation of the storage node contact hole 50 a due to misregistration of the bit line 25, as described with reference to an embodiment 8 of the present invention. In this case, the exposed part of the silicon nitride film 57 a is exposed to etching gas for a time corresponding to that up to exposure of the surface of the epitaxial silicon growth layer 37 a. As compared with the case of forming a contact hole exposing the surface of the n-type source/drain region 15 a as a storage node contact hole, therefore, the time required for etching is reduced. Thus, the silicon nitride film 57 a is inhibited from being etched to expose a surface of the bit line 25. Further, the titanium nitride film 52 a formed in the storage node contact hole 50 a can prevent the storage node 28 c and the bit line 25 from an electrical short.

[0289] Further, the peripheral circuit contact holes 58 a, 58 b, 58 c and 58 d are formed in the silicon oxide films 26 and 17 and the peripheral circuit contact holes 59 a, 59 b, 59 c and 59 d are formed in the interlayer insulation film 29 as contact holes in the peripheral circuit region 1 b. As compared with the case of forming contact holes in the interlayer insulation film 29 and the silicon oxide films 17 and 26 through a single step, therefore, the aspect ratios of the peripheral circuit contact holes 58 a to 58 d and 59 a to 59 d are further reduced, and the peripheral circuit contact holes 58 a to 58 d and 59 a to 59 d can be readily formed.

[0290] When a cell plate contact hole 30 and the peripheral circuit contact holes 59 a, 59 b, 59 c and 59 d are simultaneously formed, a surface of the cell plate 28 c is exposed on the bottom of the cell plate contact hole 30 in advance. The exposed surface of the cell plate 28 c is exposed to plasma for a time corresponding to that required for etching up to exposure of surfaces of the titanium nitride films 52 b, 52 c, 52 d and 52 e. As compared with the case of forming contact holes exposing surfaces of the n- and p-type source/drain regions 15 a, 15 b, 16 a and 16 b, therefore, the time for exposing the cell plate 28 c to the plasma is reduced. Thus, the cell plate 28 c can be prevented from being damaged by the etching, or the cell plate contact hole 30 can be prevented from passing through the cell plate 28 c.

[0291] Further, the silicon nitride film 56 a is formed to cover the gate electrode portion extending on the element isolation oxide film 2 a of the memory cell region 1 a, while no silicon nitride film is formed on the gate electrode portion of the element forming region A. This is because a silicon nitride film is formed to cover the gate electrode portions, including the gate electrode portion 8 a, formed in the memory cell region 1 a at first and a part of this silicon nitride film located on a prescribed opening is removed in formation of the element forming region A, as described in detail with reference to the embodiment 8.

[0292] Embodiment 8

[0293] As the embodiment 8 of the present invention, an exemplary method of fabricating the DRAM according to the embodiment 7 is now described with reference to FIGS. 39 to 53. Referring to FIGS. 39 and 2, a silicon nitride film (not shown) is formed on a silicon substrate 1 to cover gate electrode portions 8 a, 8 b and 8 c before formation of a silicon oxide film 17, in a step similar to that shown in FIG. 2. Thereafter a photoresist film (not shown) covering a memory cell region 1 a is employed as a mask to anisotropically etch the silicon nitride film, for removing a part of the silicon nitride film from a peripheral circuit region 1 b while leaving a silicon nitride film 56 a only in the memory cell region 1 a. The silicon oxide film 17 is formed on the silicon substrate 1, to cover this silicon nitride film 56 a. Referring to FIG. 40, a photoresist film 60 a is formed on the silicon oxide film 17. The photoresist film 60 a has an opening in a region corresponding to an element forming region A of the memory cell region 1 a.

[0294] Referring to FIG. 41, the photoresist film 60 a is employed as a mask to anisotropically etch the silicon oxide film 17, for exposing a part of the silicon nitride film 56 a in the region corresponding to the element forming region A. At this time, etching gas is preferably prepared by mixing CO gas into CHF₃ gas. According to “SiO₂/Si₂N₄ High Selection Ratio in SAC Etching” by Morio, Monthly Semiconductor World, November 1995, pp. 83-85, for example, the silicon oxide film 17 can be etched more quickly than the silicon nitride film 56 a by employing this mixed gas. In other words, the etching selection ratio between the silicon nitride film 56 a and the silicon oxide film 17 can be set at a relatively large value.

[0295] An opening 61 formed in this step has a considerably larger opening area as compared with a bit line contact hole and a storage node contact hole. Therefore, the aspect ratio of the opening 61 is substantially reduced. After a part of the silicon nitride film 56 a formed on the gate electrode portion 8 a is exposed, therefore, the opening 61 can be readily formed without excessively etching this part. Referring to FIG. 42, the exposed part of the silicon nitride film 56 a is removed. Referring to FIG. 43, epitaxial silicon growth layers 37 a and 37 b are selectively formed on n-type source/drain regions 15 a and 15 b respectively by chemical vapor deposition or the like. Referring to FIG. 44, a silicon oxide film 54 is formed in the opening 61 to cover the epitaxial silicon growth layers 37 a and 37 b.

[0296] Referring to FIG. 45, a photoresist film 60 b is formed on the silicon oxide films 17 and 54. This photoresist film 60 b is employed as a mask to anisotropically etch the silicon oxide film 54, for forming a bit line contact hole 18 a exposing a surface of the epitaxial silicon growth layer 37 b. Referring to FIG. 46, a titanium silicide film 38 a and a titanium nitride film 23 a are formed in the bit line contact hole 18 a through a step similar to that described with reference to the embodiment 6.

[0297] Referring to FIG. 47, a bit line 25 which is electrically connected to the titanium nitride film 23 a is formed on the silicon oxide film 54. A silicon nitride film 57 a is formed to cover the bit line 25. A silicon oxide film 26 is formed on the silicon oxide films 17 and 54, to cover the silicon nitride film 57 a. A photoresist film 60 c is formed on the silicon oxide film 26. This photoresist film 60 c is employed as a mask to anisotropically etch the silicon oxide films 26 and 54 for forming a storage node contact hole 50 a exposing a surface of the epitaxial silicon growth layer 37 a in the memory cell region 1 a. In the peripheral circuit region 1 b, on the other hand, peripheral circuit contact holes 58 a and 58 b are formed to expose surfaces of the n-type source/drain regions 15 a and 15 c respectively. Further, peripheral circuit contact holes 58 c and 58 d are formed to expose surfaces of the p-type source/drain regions 16 a and 16 b respectively.

[0298] Referring to FIG. 48, a titanium silicide film 38 b and a titanium nitride film 52 a are formed in the bit line contact hole 50 a through steps similar to those shown in FIGS. 34, 35 and 36 described with reference to the embodiment 6. Further, titanium silicide films 24 c, 24 d, 24 e and 24 f and titanium nitride films 52 b, 52 c, 52 d and 52 e are formed in the peripheral circuit contact holes 58 a, 58 b, 58 c and 58 d respectively.

[0299] Referring to FIG. 49, a storage node 28 a which is electrically connected to the titanium nitride film 52 a is formed on the silicon oxide film 26. A cell plate 28 c is formed on the storage node 28 a with a capacitor dielectric film 28 b interposed. An interlayer insulation film 29 is formed on the silicon oxide film 26 to cover the cell plate 28 c. A photoresist film (not shown) is formed on the interlayer insulation film 29. This photoresist film is employed as a mask to anisotropically etch the interlayer insulation film 29, for forming a cell plate contact hole 30 exposing a surface of the cell plate 28 c. Further, peripheral circuit contact holes 59 a, 59 b, 59 c and 59 d are formed to expose surfaces of the titanium nitride films 52 b, 52 c, 52 d and 52 e respectively.

[0300] Thereafter a titanium nitride film 32 a is formed in the cell plate contact hole 30. Further, titanium nitride films 53 a, 53 b, 53 c and 53 d are formed in the peripheral circuit contact holes 59 a, 59 b, 59 c and 59 d respectively. Thereafter prescribed wires 33 are formed on the interlayer insulation film 29. Thus, the DRAM shown in FIG. 38 is completed.

[0301] In addition to effects of reducing leakage currents and attaining excellent electrical connection between an element of the memory cell region 1 a and those of the peripheral circuit region 1 b as described with reference to the embodiment 6, the aforementioned fabrication method has the following effects: FIG. 50 shows a plane structure in the step shown in FIG. 40, and the section shown in FIG. 42 is taken along the line L1-L1 in FIG. 50. Referring to FIGS. 41, 42 and 50, the opening 61 formed in the silicon oxide film 17 on the element forming region A of the memory cell region 1 a has a sufficiently large opening sectional area as compared with the bit line contact hole 18 a. Thus, the aspect ratio of the opening 61 is substantially further reduced, so that the opening 61 can be readily formed in the step shown in FIG. 41.

[0302] At this time, the part of the silicon nitride film formed on the gate electrode 8 a is exposed in advance. Due to the reduced aspect ratio, however, the part of the silicon nitride film exposed in advance can be inhibited from being excessively etched before those of the silicon nitride film formed on the surfaces of the n-type source/drain regions 15 a and 15 b are exposed. Therefore, sidewall oxide films 12 located under the part of the silicon nitride film exposed in advance can be prevented from being etched. Thus, electrical insulation between the epitaxial silicon growth layers 37 a and 37 b and the gate electrode 8 a is improved.

[0303] Referring to FIGS. 50 and 51, a deviating bit line contact hole 18 b may be formed due to misalignment or the like. In this case, an end portion of the upper surface of the epitaxial silicon growth layer 37 b is exposed. FIG. 51 is a sectional view taken along the line L2-L2 in FIG. 50. The epitaxial silicon growth layer 37 b is formed to extend over the gate electrode portion 8 a. Therefore, the gate electrode portion 8 a and the sidewall oxide films 12 can be prevented from being etched in formation of the bit line contact hole 18 b. Consequently, the bit line 25 thereafter formed and the gate electrode can be prevented from an electrical short.

[0304] As described with reference to FIG. 89 in relation to the prior art, on the other hand, a deviating storage node contact hole 50 b may be formed as shown in FIG. 52, due to misalignment or the like. In this case, the exposed surface of the silicon nitride film 57 a covering the bit line 25 is exposed to etching gas for a time corresponding to that up to exposure of the surface of the epitaxial silicon growth layer 37 a. As compared with the case of forming a storage node contact hole exposing the surface of the n-type source/drain region 15 a with no presence of the epitaxial silicon growth layer 37 a, therefore, the time for exposing the precedently exposed surface of the silicon nitride film 57 a to the etching gas is reduced. Thus, the exposed surface of the silicon nitride film 57 a can be inhibited from being excessively etched to expose the bit line 25. Consequently, the storage node 28 a thereafter formed and the bit line 25 can be prevented from an electrical short.

[0305] Further, the storage node 28 a and the gate electrode portion 8 a can also be prevented from an electrical short similarly to the case of the bit line 25.

[0306] Even if any bit line contact hole or storage node contact hole deviates from a prescribed position due to misalignment or the like as described above, a DRAM including a memory cell region 1 a shown in FIG. 53 is formed. Also in such a DRAM, a bit line 25, a storage node 28 a and a MOS transistor T1 are electrically connected on prescribed portions respectively, to be prevented from electrical shorts in portions other than the prescribed ones.

[0307] Further, the fabrication method according to the embodiment 8 of the present invention attains the following additional effects as compared with that according to the embodiment 6:

[0308] As the first effect, the number of the steps can be reduced in this embodiment. According to the embodiment 8, the epitaxial silicon growth layers 37 a and 37 b can be selectively formed only on the n-type source/drain regions 15 a and 15 b of the memory cell region 1 a. Therefore, the sidewall oxide films 12 may not be independently formed in the memory cell region 1 a and the peripheral circuit region 1 b for selectively forming the epitaxial silicon growth layers 37 a and 37 b only on the n-type source/drain regions 15 a and 15 b as shown in FIGS. 29 to 31 in relation to the embodiment 6, but can be formed through a single step. Consequently, the number of the steps can be reduced.

[0309] As the second effect, the ratio (aspect ratio) of a component (component A) growing in parallel with the surface of the silicon substrate 1 to that (component B) growing perpendicularly to this surface can be more readily controlled in the growing process of the epitaxial silicon growth layers 37 a and 37 b in the embodiment 8, as compared with the embodiment 6. This effect is now described in detail.

[0310] In the embodiment 6 of the present invention, the epitaxial silicon growth layers 37 a and 37 b are formed in the step shown in FIG. 30. At this time, no insulator film such as a silicon oxide film is formed on the element isolation oxide film 2 a of the memory cell region 1 a, except a part of the gate electrode portion 8 a. In the embodiment 8, on the other hand, the epitaxial silicon growth layers 37 a and 37 b are formed in the step shown in FIG. 43. At this time, the silicon nitride film 56 a and the silicon oxide film 17 are formed on the element isolation oxide film 2 a of the memory cell region 1 a to cover the gate electrode portion 8 a, in addition to the part of the gate electrode portion 8 a. When the epitaxial silicon growth layers 37 a and 37 b are formed in each element forming region A, therefore, the silicon nitride film 56 a and the silicon oxide film 17 are present between adjacent ones of the adjacent epitaxial silicon growth layers 37 a and 37 b located along the longitudinal direction of the gate electrode 8 a, as shown in FIG. 50 in particular. Thus, electrical insulation between the adjacent ones of the epitaxial silicon growth layers 37 a and 37 b is maintained in the growth process, regardless of the component A.

[0311] In the embodiment 6, however, no such insulator films are present in formation of the epitaxial silicon growth layers 37 a and 37 b. Depending on the component A, therefore, the epitaxial silicon growth layer may extend over the element isolation oxide film 2 a, to be electrically shorted with the adjacent one. In order to prevent this, the components A and B must be so controlled that such adjacent epitaxial silicon growth layers are not in contact with each other. In the embodiment 8 requiring no particular consideration of the component A, therefore, the aspect ratio can be more readily controlled in formation of the epitaxial silicon growth layers 37 a and 37 b, as compared with the embodiment 6.

[0312] As the third effect, margins for misalignment in photolithography are increased in formation of the bit line contact hole 18 a and the storage node contact hole 50 a in the embodiment 8, as compared with the embodiment 6. This effect is now described in detail.

[0313] If photolithography is misaligned particularly in the longitudinal direction of the gate electrode portion 8 a in formation of the bit line contact hole 18 a in the silicon oxide film 17 in the embodiment 6 as shown in FIG. 33, for example, the bit line contact hole 18 a may expose the element isolation oxide film 2 a which is located under the silicon oxide film 17 or a part of the gate electrode portion 8 a.

[0314] In the embodiment 8, on the other hand, the bit line contact hole 18 a is formed in the silicon oxide film 17, as shown in FIG. 51. At this time, the silicon nitride film 56 a is formed under the silicon oxide film 17 except the element forming region A. Thus, only the silicon oxide film 17 can be etched while substantially leaving the silicon nitride film 56 a. Even if photolithography is misaligned in the longitudinal direction of the gate electrode portion 8 a, therefore, the silicon nitride film 56 a can serve as a protective film for preventing the bit line contact hole 18 a from exposing the element isolation oxide film 2 a or a part of the gate electrode portion 8 a. This also applies to the storage node contact hole 50 a. Thus, the margins for misalignment of the photolithography in formation of the bit line contact hole 18 a and the storage node contact hole 50 a are increased in the embodiment 8, as compared with the embodiment 6.

[0315] While each of the embodiments has been described with reference to a DRAM serving as a semiconductor device, each of the aforementioned structures is also applicable to a semiconductor device other than the DRAM, for obtaining a semiconductor device which reduces leakage currents, attains a high-speed operation and has excellent electrical insulation and connectability.

[0316] Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the spirit and scope of the present invention being limited only by the terms of the appended claims. 

What is claimed is:
 1. A semiconductor device comprising: a semiconductor substrate having a major surface; a first region being formed on said major surface of said semiconductor substrate; a first impurity region being formed on a surface of said first region; a first conductor layer being formed on a surface of said first impurity region; a second conductor layer being formed on said first conductor layer; a third conductor layer being formed on said second conductor layer; a first insulator layer being formed on said semiconductor substrate to enclose said first to third conductor layers; and a first conductor region being formed on said first insulator layer and electrically connected with said third conductor layer, said first conductor layer containing silicon, said second conductor layer containing a compound of silicon and a prescribed metal, said third conductor layer containing prescribed said metal or a compound of said metal.
 2. The semiconductor device in accordance with claim 1 , wherein said first insulator layer has a first contact hole exposing a surface of said first conductor layer, and said second and third conductor layers are formed in said first contact hole.
 3. The semiconductor device in accordance with claim 2 , further including: a pair of source/drain regions being provided on a major surface of said first region at a space, and a gate electrode being formed on a region of said semiconductor substrate being held between respective ones of said source/drain regions with a gate insulator film interposed, wherein one of said source/drain regions includes said first impurity region, and said first conductor layer is formed in the vicinity of said gate electrode to partially cover said gate electrode while being electrically insulated from said gate electrode.
 4. The semiconductor device in accordance with claim 3 , wherein said first region includes a plurality of element forming regions and an element isolation region electrically insulating said element forming regions from each other, and said gate electrode includes a first gate electrode portion extending on each said element forming region and a second gate electrode portion being connected with said first gate electrode portion and extending on said element isolation region, said semiconductor device further including a second protective layer being formed under said first insulator layer to cover said second gate electrode portion.
 5. The semiconductor device in accordance with claim 1 , further including: a second impurity region being formed on a major surface of said first region at a space from said first impurity region, a fourth conductor layer, containing silicon, being formed on a surface of said second impurity region, a first protective layer being formed to cover a surface of said first conductor region, and a second insulator layer being formed on said first insulator layer to cover said first protective layer, wherein said first and second insulator layers have a second contact hole exposing a surface of said fourth conductor layer, said semiconductor device further including: a fifth conductor layer, containing a compound of silicon and prescribed said metal, being formed in said second contact hole and electrically connected with said fourth conductor layer, a sixth conductor layer, containing prescribed said metal or a compound of said metal, being formed on said fifth conductor layer in said second contact hole, and a second conductor layer being formed on said second insulator layer and electrically connected with said sixth conductor layer.
 6. The semiconductor device in accordance with claim 5 , wherein the other one of said pair of source/drain regions includes said second impurity region, and said gate electrode is formed on a region being held between said first and second impurity regions.
 7. The semiconductor device in accordance with claim 5 , further including: a second region being formed on said major surface of said semiconductor substrate and electrically insulated from said first region, a third impurity region being formed on a surface of said second region, and a third insulator layer being formed on said second insulator layer to cover said first and second regions, wherein said first and second insulator layers have a third contact hole exposing a surface of said third impurity region, said third insulator layer has a fourth contact hole communicating with said third contact hole, and said third insulator layer has a fifth contact hole exposing a surface of said second conductor region, said semiconductor device further including: a first columnar conductor being formed in said third contact hole and electrically connected with said third impurity region, a second columnar conductor being formed in said fourth contact hole and electrically connected with said first columnar conductor, a third columnar conductor being formed in said fifth contact hole, a first wiring layer being electrically connected with said second columnar conductor and formed on said third insulator layer, and a second wiring layer being electrically connected with said third columnar conductor and formed on said third insulator layer.
 8. The semiconductor device in accordance with claim 7 , wherein said first and second wiring layers are formed by the same layer.
 9. The semiconductor device in accordance with claim 7 , further including a relay conductor, larger in sectional area than said first columnar conductor, being formed on said second insulator layer to intervene between said first and second columnar conductors.
 10. The semiconductor device in accordance with claim 9 , wherein said relay conductor is formed by the same layer as said second conductor region.
 11. The semiconductor device in accordance with claim 1 , further including: a third region being formed on said major surface of said semiconductor substrate and electrically insulated from said first region, a fourth impurity region being formed on a surface of said third region, and a fourth insulator layer being formed on s aid first insulator layer to cover said first and third regions, wherein said first insulator layer has a sixth contact hole exposing a surface of said fourth impurity region, said fourth insulator layer has a seventh contact hole communicating with said sixth contact hole, and said fourth insulator layer has an eighth contact hole exposing a surface of said first conductor region, said semiconductor device further including: a fourth columnar conductor being formed in said sixth contact hole and electrically connected with said fourth impurity region, a fifth columnar conductor being formed in said seventh contact hole and electrically connected with said fourth columnar conductor, a sixth columnar conductor being formed in said eighth contact hole, and a third wiring layer being electrically connected with said fifth and sixth columnar conductors and formed on said fourth insulator layer.
 12. A method of fabricating a semiconductor device comprising steps of: forming a first impurity region on a major surface of a semiconductor substrate; forming a first conductor layer containing silicon on a surface of said first impurity region; forming a conductive material layer containing a prescribed metal on said first conductor layer and heat-treating the same thereby forming a second conductor layer containing a compound of said silicon being contained in said conductor layer and prescribed said metal; forming a third conductor layer containing said metal or a compound of said metal on said second conductor layer; forming a first insulator layer on said semiconductor substrate to enclose said first to third conductor layers; and forming a first conductor region being electrically connected with said third conductor layer on said first insulator layer.
 13. The method of fabricating a semiconductor device in accordance with claim 12 , wherein said steps of forming said second and third conductor layers include steps of: forming a first contact hole exposing a surface of said first conductor layer in said first insulator layer, and forming said second and third conductor layers in said first contact hole.
 14. The method of fabricating a semiconductor device in accordance with claim 13 , further including steps of: forming a gate electrode on said major surface of said semiconductor substrate with a gate insulator film interposed, and forming a pair of source/drain regions on said major surface of said semiconductor substrate both sides of said gate electrode, wherein said step of forming said source/drain regions includes a step of forming said first impurity region, and said step of forming said first conductor layer includes a step of forming said first conductor layer in the vicinity of said gate electrode to partially enclose said gate electrode while being electrically insulated from said gate electrode.
 15. The method of fabricating a semiconductor device in accordance with claim 14 , further including steps of: forming a plurality of element forming regions and an element isolation region electrically insulating said element forming regions from each other in said first region, forming a first gate electrode portion extending on each said element forming region and a second gate electrode portion being connected with said first gate electrode portion and extending on said element isolation region as said gate electrode, and forming a second protective layer to cover said gate electrode, in advance of said step of forming said first insulator layer, said method further including steps of: forming an opening exposing a surface of said second protective layer in said first insulator layer being located on each said element forming region including a portion on said first gate electrode portion, and removing exposed said second protective layer thereby exposing a surface of said element forming region including said first gate electrode portion.
 16. The method of fabricating a semiconductor device in accordance with claim 12 , further including steps of: forming a second impurity region on a major surface of said first region of said semiconductor substrate at a space from said first impurity region, and forming a fourth conductor layer containing silicon on said second impurity region, in advance of said step of forming said first insulator layer, said method further including steps of: forming a first protective layer on a surface of said first conductor region, forming a second insulator layer on said first insulator layer to cover said first protective layer, forming a second contact hole exposing a surface of said fourth conductor layer in said first and second insulator layers, forming a conductive material layer containing prescribed said metal in said second contact hole and heat-treating the same thereby forming a fifth conductor layer containing a compound of said silicon being contained in said fourth conductor layer and prescribed said metal, forming a sixth conductor layer containing said metal or a compound of said metal on said fifth conductor layer in said second contact hole, and forming a second conductor region being electrically connected with said sixth conductor layer on said second insulator layer.
 17. The method of fabricating a semiconductor device in accordance with claim 16 , wherein said step of forming said pair of source/drain regions includes said steps of forming said first and second impurity regions, and said step of forming said gate electrode includes a step of forming said gate electrode on a region of said semiconductor substrate being held between said first and second impurity regions.
 18. The method of fabricating a semiconductor device in accordance with claim 16 , further including steps of: forming a first region including said first and second impurity regions on said major surface of said semiconductor substrate, and forming a second region being electrically insulated from said first region on said major surface of said semiconductor substrate, forming a third impurity region on said major surface of said second region, in advance of said step of forming said first insulator layer, and forming a third contact hole exposing a surface of said third impurity region in said first and second insulator layers, forming a first columnar conductor in said third contact hole, forming a third insulator layer on said second insulator layer to cover surfaces of said second conductor region and said first columnar conductor, forming fourth and fifth contact holes exposing surfaces of said first columnar conductor and said second conductor region respectively in said third insulator layer, forming a second columnar conductor in said fourth contact hole, forming a third columnar conductor in said fifth contact hole, and forming first and second wiring layers being electrically connected with said third and second columnar conductors respectively on said third insulator layer, after said step of forming said second insulator layer.
 19. The method of fabricating a semiconductor device in accordance with claim 18 , further including a step of forming a relay conductor, larger in sectional area than said first columnar conductor, being electrically connected with said first columnar conductor on said second insulator layer between said steps of forming said first columnar conductor and forming said second columnar conductor.
 20. The method of fabricating a semiconductor device in accordance with claim 19 , wherein said step of forming said relay conductor is carried out simultaneously with said step of forming said second conductor region. 